Abstract: An implantable heart assist system includes a compressible pumping chamber including an inlet conduit to be placed in fluid connection with the descending thoracic aorta and an outlet conduit to be placed in fluid connection with the thoracic aorta; and a pump system comprising a first rigid member, a second rigid member positioned so that at least a portion of the pumping chamber may be positioned between the first and second rigid members, a drive system configured to cause the second rigid member to move toward or away from the first rigid member, and a controller in operative connection with the drive system and controlling the drive system, wherein movement of the second rigid member toward the first rigid member results in compresses the pumping chamber and movement of the second rigid member away from the first rigid member expands the pumping chamber.

Abstract: An implantable heart assist system, includes a pumping chamber formed of a flexible material and being adapted to be placed in fluid connection with the aorta and a pump system comprising a first rigid member and a spaced apart second rigid member so that at least a portion of the pumping chamber may be positioned therebetween, a drive system comprising a motor. The motor is adapted to cause the second rigid member to move toward the first rigid member to compress the pumping chamber or away from the first rigid member to expand the pumping chamber. A controller is in operative connection with the drive system and controlling the motor.

Abstract: A system includes an implantable pump system for assisting blood flow in a patient including at least one movable valve. The movable valve is in a normally open state when the moveable valve is not being powered and a drive system in operative connection with the moveable valve to move the moveable valve under power. The system further includes an energy transfer system to provide energy to the drive system. The energy transfer system includes an external system including a power source and an external coil and an internal system including an internal coil adapted to receive transcutaneous energy transmitted from the external coil. The internal system has at least a first state wherein energy transmission from the external coil is required to provide operational power to the drive system.

Abstract: A system includes an implantable pump system for assisting blood flow in a patient including at least one movable valve. The movable valve is in a normally open state when the moveable valve is not being powered and a drive system in operative connection with the moveable valve to move the moveable valve under power. The system further includes an energy transfer system to provide energy to the drive system. The energy transfer system includes an external system including a power source and an external coil and an internal system including an internal coil adapted to receive transcutaneous energy transmitted from the external coil. The internal system has at least a first state wherein energy transmission from the external coil is required to provide operational power to the drive system.

Abstract: An injector for use in injecting a fluid in a medical injection procedure includes a drive having a motor to pressurize the fluid; a sensor to provide a measure of fluid pressure; and a pressure monitor in communication with the sensor and the drive to stop the motor using 4-quadrant control when the sensor communicates a measured pressure of at least a pressure hazard limit. The pressure monitor also limits power input to the motor to a power limit once the sensor communicates a measured pressure of at least a power limiting pressure. The power limiting pressure is below the pressure hazard limit.

Abstract: An injector for use in injecting a fluid in a medical injection procedure includes a drive having a motor to pressurize the fluid; a sensor to provide a measure of fluid pressure; and a pressure monitor in communication with the sensor and the drive to stop the motor using 4-quadrant control when the sensor communicates a measured pressure of at least a pressure hazard limit. The pressure monitor also limits power input to the motor to a power limit once the sensor communicates a measured pressure of at least a power limiting pressure. The power limiting pressure is below the pressure hazard limit.

Abstract: An injector for use in injecting a fluid in a medical injection procedure includes a drive having a motor to pressurize the fluid; a sensor to provide a measure of fluid pressure; and a pressure monitor in communication with the sensor and the drive to stop the motor using 4-quadrant control when the sensor communicates a measured pressure of at least a pressure hazard limit. The pressure monitor also limits power input to the motor to a power limit once the sensor communicates a measured pressure of at least a power limiting pressure. The power limiting pressure is below the pressure hazard limit.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Abstract: Disclosed is a ceramic substrate having a protective coating on at least one surface thereof which includes:a ceramic substrate having at least one electrically conductive via extending to a surface of the substrate;an electrically conductive I/O pad electrically connected to at least one of the vias;an I/O pin brazed to the I/O pad, the brazed pin having a braze fillet; anda protective layer of polymeric material fully encapsulating the I/O pad, wherein the layer of polymeric material protects the I/O pad from corrosion.

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Abstract: In a soldering process for joining a plurality of metal components wherein a flux is employed to promote the process, the improvement comprises using as a flux in the process a flux consisting essentially of dihydroabietyl alcohol or dihydroabietyl alcohol and a member selected from the group consisting of a thermally depolymerizable polymer or a mixture of thermally depolymerizable polymers having the structure: ##STR1## where X and Y are n-alkyl and iso-alkyl not exceeding 6 carbon atoms; halogen; --COOR where R is n-alkyl and iso-alkyl not exceeding 6 carbon atoms; phenyl, naphthyl, tolyl and methyl-naphthyl groups; n is 5 to 500, and mixtures thereof.