Abstract: The resistive probing tip system has one or more carriers and one or more electrical contact assemblies. Each carrier has opposing surfaces with a plurality of resistors engaging the carrier. Each of the plurality of resistors has opposing electrical contacts that are exposed at respective opposing surfaces of the carrier. Each electrical contact assembly has opposing surfaces with electrical contacts exposed at the opposing surfaces with each electrical contact exposed on one surface coupled to a corresponding electrical contact on the other opposing surface. The carrier(s) and the electrical contact assembly(s) selectively mate to and mate from one another with the electrical contacts exposed at the opposing surfaces the carrier(s) and the electrical contact assembly(s) contacting one another. The carrier(s) and/or the electrical contact assembly(s) may be selectively secured to either of a circuit board or a probe head.

Abstract: An optical networking module is formed with an integrated module including optical, optical-electrical and protocol processing components, and complementary software. In one embodiment, the integral protocol processing component is a single ASIC and supports multiple protocols. The module is further equipped with support control electronics in support of control functions to manage the optical, optical-electrical as well as the multi-protocol processing component. The integrated module together with the complementary control software present to an optical networking equipment designer/developer a singular component that handles optical to electrical and electrical to optical conversion, as well as data link and physical sub-layer processing for a selected one of a plurality of datacom and telecom protocols, spanning local, regional as well as wide area networks.

Abstract: An optical networking module is formed with an integrated module including optical, optical-electrical and protocol processing components, and complementary software. In one embodiment, the integral protocol processing component is a single ASIC and supports multiple protocols. The module is further equipped with support control electronics in support of control functions to manage the optical, optical-electrical as well as the multi-protocol processing component. The integrated module together with the complementary control software present to an optical networking equipment designer/developer a singular component that handles optical to electrical and electrical to optical conversion, as well as data link and physical sub-layer processing for a selected one of a plurality of datacom and telecom protocols, spanning local, regional as well as wide area networks.

Abstract: An optical networking module is formed with an integrated module including optical, optical-electrical and protocol processing components, and complementary software. In one embodiment, the integral protocol processing component is a single ASIC and supports multiple protocols. The module is further equipped with support control electronics in support of control functions to manage the optical, optical-electrical as well as the multi-protocol processing component. The integrated module together with the complementary control software present to an optical networking equipment designer/developer a singular component that handles optical to electrical and electrical to optical conversion, as well as data link and physical sub-layer processing for a selected one of a plurality of datacom and telecom protocols, spanning local, regional as well as wide area networks.

Abstract: A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.

Abstract: A method and apparatus for maintaining an alignment of a laser diode with an optical fiber is disclosed. A mounting plate is made of a first material, and mounted on the mounting plate is a first substrate made of a second material. A semiconductor laser, with a light emitting side, is mounted on the first substrate. Separated from the first substrate by a predetermined distance is a second substrate made of a third material, and mounted on the second substrate is an optical fiber. The optical fiber is mounted, such that, the optical fiber is adjacent to and aligned with the light emitting side of the semiconductor laser. The first, second, and third materials making up the mounting plate, the first substrate, and the second substrate respectively, facilitate maintenance of the alignment between the optical fiber and the light emitting side of the semiconductor laser.

Abstract: An optical networking module is formed with an integrated module including optical, optical-electrical and protocol processing components, and complementary software. In one embodiment, the integral protocol processing component is a single ASIC and supports multiple protocols. The module is further equipped with support control electronics in support of control functions to manage the optical, optical-electrical as well as the multi-protocol processing component. The integrated module together with the complementary control software present to an optical networking equipment designer/developer a singular component that handles optical to electrical and electrical to optical conversion, as well as data link and physical sub-layer processing for a selected one of a plurality of datacom and telecom protocols, spanning local, regional as well as wide area networks.

Abstract: A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.

Abstract: An optical networking module is formed with an integrated module including optical, optical-electrical and protocol processing components, and complementary software. In one embodiment, the integral protocol processing component is a single ASIC and supports multiple protocols. The module is further equipped with support control electronics in support of control functions to manage the optical, optical-electrical as well as the multi-protocol processing component. The integrated module together with the complementary control software present to an optical networking equipment designer/developer a singular component that handles optical to electrical and electrical to optical conversion, as well as data link and physical sub-layer processing for a selected one of a plurality of datacom and telecom protocols, spanning local, regional as well as wide area networks.

Abstract: An optical waveguide photocathode for converting optical signals to electrical signals has an optical waveguide, a semiconductor covering the end of the optical waveguide, a first transparent electrode disposed between the end of the waveguide and the semiconductor, and a second electrode disposed adjacent to and spaced from the semiconductor. An electric potential is applied between the first electrode and the second electrode. The waveguide, first conductor, and semiconductor are relatively pointed at the end to produce high electric field strength at the semiconductor thereby enabling semiconductors with high work functions to be used. The relatively small area of the semiconductor illuminated by the waveguide reduces the dark current, making the device more sensitive to low level signals. The device may be used in a streak tube or a photomultiplier.

Abstract: A method and apparatus for measuring the width of pulses in the gigahertz range comprises the steps of splitting an input pulse and delaying one of the pulses prior to their recombination in a directional coupler. The recombined pulse is then measured in a power meter. By varying the delay, maximum and minimum readings from the power meter may be found. The pulse width may then be found as a function of the actual delay, which may be controlled by the user by varying the distance through a waveguide that the delayed pulse must travel.

Abstract: A method and apparatus for maintaining an alignment of a laser diode with an optical fiber is disclosed. A mounting plate is made of a first material, and mounted on the mounting plate is a first substrate made of a second material. A semiconductor laser, with a light emitting side, is mounted on the first substrate. Separated from the first substrate by a predetermined distance is a second substrate made of a third material, and mounted on the second substrate is an optical fiber. The optical fiber is mounted, such that, the optical fiber is adjacent to and aligned with the light emitting side of the semiconductor laser. The first, second, and third materials making up the mounting plate, the first substrate, and the second substrate respectively, facilitate maintenance of the alignment between the optical fiber and the light emitting side of the semiconductor laser.

Abstract: A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.