Patents by Inventor Richard A. Case

Richard A. Case has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230182794
    Abstract: A lift truck useful for positioning, placement, and mounting of renewable energy storage devices includes a lifting bracket and tongue raised and lowered by a powered jackscrew lift system. In use, the tongue is placed under a battery system and positioned at the place of installation. Once positioned, the truck is activated, raising the battery system and holding it in place during installation. With the use of the truck, a single technician is able to install the battery system, and risk of physical injury is minimized because the weight of the battery system is entirely supported by the truck during installation.
    Type: Application
    Filed: December 12, 2022
    Publication date: June 15, 2023
    Inventor: Richard A. Case
  • Patent number: 5189275
    Abstract: A method of applying discrete areas of a noble metal to individual pads on a flexible printed circuit board comprises the steps of forming a particular pattern of electrically conductive material on a flexible, electrically insulating substrate. The pattern includes individual pads. An aperture is formed through the electrically insulating substrate to expose a portion of the underside of at least one of the individual pads, and then contacting the underside with an electrode, contacting the upper surface of the individual pad with a wire comprised of the noble metal, applying a welding current between the electrode and the wire to weld the wire to the pad and severing the wire to leave a particular amount on the upper surface of the pad.
    Type: Grant
    Filed: August 21, 1989
    Date of Patent: February 23, 1993
    Assignee: GTE Products Corporation
    Inventors: Frank J. Avellino, Richard A. Case, David T. Swanson
  • Patent number: 4925522
    Abstract: A method of making printed circuit boards having gold dot contacts formed on the terminal pads is disclosed. A first layer of copper is overlayed with a pattern of tin or solder which acts as a resist. The gold dot contacts are resistance welded to the terminal pads. The copper underlayment and its pattern of tin or solder carrying the gold dots is then bonded to an electrically insulating substrate, which can be flexible, to form a composite board which is then etched to form a printed circuit board having gold dot contacts thereon. Other materials than tin or solder can be employed so long as there is a difference in etchability between it and the copper foil.
    Type: Grant
    Filed: August 21, 1989
    Date of Patent: May 15, 1990
    Assignee: GTE Products Corporation
    Inventors: Frank J. Avellino, Richard A. Case, David T. Swanson