Abstract: A flexible polyimide film is used to support an array of precisely located contact bumps which are used to probe die on a wafer of semiconductor circuits, or an unmounted integrated circuit die, several integrated circuits, or hybrid devices. By utilizing a standard I/O contact pattern for the flexible film and fabricating the membrane assembly of interconnects on an aluminum substrate, it is possible to produce a more reliable probe card, while reducing the fabrication time and costs for the probe card. The polyimide film must be selected to have a CTE of 3 to 5, which is only about 1/5 to 1/7 as great as the CTE of the aluminum substrate on which the film is formed. This produces a critical degree of compressive stress in the polyimide film, and a resulting "bow" of the film when the central area of the aluminum is etched away.

Abstract: A single article dispensing apparatus adapted for newspaper vending captures a bundle of newspapers between opposing support plates with one movable plate being spring biased toward the stationary plate. Newspaper engaging pins extend beyond the stationary support plate and into the space between the opposing support plates to engage the back edge of a newspaper of the bundle. Upon deposit of the necessary coins and pulling of a dispensing handle, the newspaper engaging pins slide the newspaper from the bundle and out through an output door of the vending machine. When all newspapers in the bundle are dispensed and the support plates come to direct face-to-face opposition, a last copy of the newspaper held behind a display window is automatically dispensed upon the next actuation of the dispensing handle. The vending machine restricts access to the inventory of newspapers and allows a purchaser but one copy of the newspaper for payment of one copy.

Abstract: Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.