Patents by Inventor Richard A. Heckelsberg

Richard A. Heckelsberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rapid densification of porous bodies (preforms) with high viscosity resins or pitches using a resin transfer molding process
    Patent number: 7172408
    Abstract: A resin transfer molding (RTM) process is disclosed for rapidly filling a fibrous preform and/or a rigid, porous body with high viscosity resin or pitch. The process is suitable for impregnated multiple porous bodies stacked in a single mold. The process uses a fibrous preform or rigid porous body which is placed into a mold matching the desired part geometry. A resin is injected into the mold at temperature and pressure. After cooling, the infiltrated component is removed from the mold. The mold is constructed from two halves fitted to form at least one mold cavity. A gate fitted with a nozzle is set into one of the mold halves, and a valve admits resin or pitch into the gate area. Venting or vacuum can be applied to the mold. The mold is held in a hydraulic press and an extruder, optionally fitted with an accumulator, supplies molten resin or pitch to the mold.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: February 6, 2007
    Assignee: Honeywell International, Inc.
    Inventors: Michael D. Wood, Frank Dillon, Richard A. Heckelsberg, Roger W. Holloway, Mark L. LaForest, Neil Murdie, Charles A. Parker, James F. Pigford
  • Rapid densification of porous bodies (preforms) with high viscosity resins or pitches using a resin transfer molding process
    Publication number: 20030111752
    Abstract: A resin transfer molding (RTM) process is disclosed for rapidly filling a fibrous preform and/or a rigid, porous body with high viscosity resin or pitch. The process is suitable for impregnated multiple porous bodies stacked in a single mold. The process uses a fibrous preform or rigid porous body which is placed into a mold matching the desired part geometry. A resin is injected into the mold at temperature and pressure. After cooling, the infiltrated component is removed from the mold. The mold is constructed from two halves fitted to form at least one mold cavity. A gate fitted with a nozzle is set into one of the mold halves, and a valve admits resin or pitch into the gate area. Venting or vacuum can be applied to the mold. The mold is held in a hydraulic press and an extruder, optionally fitted with an accumulator, supplies molten resin or pitch to the mold.
    Type: Application
    Filed: January 14, 2003
    Publication date: June 19, 2003
    Inventors: Michael D. Wood, Frank Dillon, Richard A. Heckelsberg, Roger W. Holloway, Mark L. LaForest, Neil Murdie, Charles A. Parker, James F. Pigford
  • Rapid densification of porous bodies (preforms) with high viscosity resins or pitches using a resin transfer molding process
    Patent number: 6537470
    Abstract: A resin transfer molding (RTM) process is disclosed for rapidly filling a fibrous preform and/or a rigid, porous body with high viscosity resin or pitch. The process is suitable for impregnated multiple porous bodies stacked in a single mold. The process uses a fibrous preform or rigid porous body which is placed into a mold matching the desired part geometry. A resin is injected into the mold at temperature and pressure. After cooling, the infiltrated component is removed from the mold. The mold is constructed from two halves fitted to form at least one mold cavity. A gate fitted with a nozzle is set into one of the mold halves, and a valve admits resin or pitch into the gate area. Venting or vacuum can be applied to the mold. The mold is held in a hydraulic press and an extruder, optionally fitted with an accumulator, supplies molten resin or pitch to the mold.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: March 25, 2003
    Assignee: Honeywell International Inc.
    Inventors: Michael D. Wood, Frank Dillon, Richard A. Heckelsberg, Roger W. Holloway, Mark L. LaForest, Neil Murdie, Charles A. Parker, James F. Pigford