Patents by Inventor Richard A. Maillet, JR.

Richard A. Maillet, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling assembly for electronics assembly of imaging system
    Patent number: 10237967
    Abstract: Among other things, an electronics assembly within an imaging system is provided. The electronics assembly includes a circuit board assembly through which a signal is delivered. The circuit board assembly defines a heat transfer opening between a first side and a second side. An electronics component is electrically coupled to the first side of the circuit board assembly. A heat transfer component supports the electronics component. The heat transfer component includes a base portion coupled to the electronics component and to the circuit board assembly. The heat transfer component includes a heat dissipation portion extending through the heat transfer opening of the circuit board assembly. The heat dissipation portion dissipates heat generated by the electronics component.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: March 19, 2019
    Assignee: Analogic Corporation
    Inventors: Richard A. Maillet, Jr., Garry Allen Fellows
  • COOLING ASSEMBLY FOR ELECTRONICS ASSEMBLY OF IMAGING SYSTEM
    Publication number: 20170099725
    Abstract: Among other things, an electronics assembly within an imaging system is provided. The electronics assembly includes a circuit board assembly through which a signal is delivered. The circuit board assembly defines a heat transfer opening between a first side and a second side. An electronics component is electrically coupled to the first side of the circuit board assembly. A heat transfer component supports the electronics component. The heat transfer component includes a base portion coupled to the electronics component and to the circuit board assembly. The heat transfer component includes a heat dissipation portion extending through the heat transfer opening of the circuit board assembly. The heat dissipation portion dissipates heat generated by the electronics component.
    Type: Application
    Filed: October 2, 2015
    Publication date: April 6, 2017
    Inventors: Richard A. Maillet, JR., Garry Allen Fellows