Abstract: A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.

Abstract: A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.

Abstract: A pressure responsive electric switch (10) is shown having an improved flexible diaphragm (28) to extend the useful life of the switch particularly when used with fluid media of a corrosive nature. The flexible diaphragm (28) comprises a base layer (28a) of resin having excellent mechanical properties over a wide range of temperature and a first level of fold endurance capability covered on one or both face surfaces with a protective layer (28b) of resin having excellent corrosion resistance capability and a second level of fold endurance capability at least as great as the first level. In a second embodiment, the flexible diaphragm is composed of biaxially oriented polyphenylene sulfide which can be used without additional protective layers.

Abstract: The poles are suited for mounting on the side of a slider carrying a magnetic head. The method allows very narrow gaps between poles. In one embodiment of the invention, a magnetic pole is deposited on a substrate. A nonmagnetic material such as Al.sub.2 O.sub.3 is deposited from the side onto the pole and substrate. A preselected pattern of photoresist is next deposited on the nonmagnetic layer and a second magnetic material is deposited. The photoresist is removed and excess magnetic material is removed by ion milling from the side opposite to that of the nonmagnetic material deposition. Another embodiment is disclosed for making two- and three-pole heads.