Abstract: A wave soldering apparatus includes a solder supply and a first wave soldering nozzle in fluid communication with the solder supply. The first wave soldering nozzle includes a flat plate having a plurality of square-shaped openings formed therein to generate a first solder wave. An inert system is configured to deliver an inert gas around the first solder wave. Other embodiments and methods of wave soldering are further disclosed.

Abstract: A method of making a cast product, includes heating an alloy to a temperature between about 1210 and 1470° F. so that the alloy is in a liquid state, injecting the alloy into a vertical die casting machine cavity, injecting the alloy into a mold having a gated configuration, wherein the injecting further comprises a shot velocity between 3-8 inches per second and a pressure between 5,000 and 14,000 psi, cooling the alloy in the mold, and forming the cast product, wherein the cast product is selected from a group consisting of suspension components, knuckles, control arms, transmission input housings, bed plates, swash plates, air conditioning compressor pistons, engine valve bodies, engine bed plates, transmission valve bodies, master cylinders, brake calipers, ABS braking components, shock mounts, engine bedplates, engine valve bodies and pump housings.

Abstract: A method of semi-solid metal casting without the need for retrofitting of conventional casting equipment is provided. A method of direct-feed casting of semi-solid metals is also provided.

Abstract: A method and product for semi-solid metal casting without the need for retrofitting of conventional casting equipment is provided. A semi solid method is used with a vertical indexing casting machine in which an indexing time can be used as the time to allow the metal that is heated to one temperature to cool to a second temperature before casting. The resulting product from the semi-solid metal casting method with the vertical indexing casting machine is also provided.

Abstract: A printed circuit board that has a surface which bears a plurality of circuit board pattern, each pattern being served with at least one individual terminal. The printed circuit board is used for a method of determining the stabilized surface insulation resistance of the substrate of the printed circuit board. The circuit board patterns are spaced-apart so as to lie upon surface band regions extending lengthwise and widthwise of the surface of the printed circuit board, these surface band regions being different from one printed circuit board pattern to another. This arrangement of circuit board patterns results in a substantial surface of the board to be dominated by the patterns suitable for the test procedure.

Abstract: To determine the stabilized surface insulation resistance (SIR) of a printed circuit board substrate, a test printed circuit board is provided which has desirable clean surface conditions. This surface bears a predetermined circuit board test pattern and has a known SIR characteristic resulting in a known stabilized SIR. The test board is then subjected to a soldering step which is performed in the same in-line production with commercial boards. After the soldering step, the SIR characteristic of the soldered test board is determined for a time period sufficient for a comparison with the SIR characteristic of the clean test board to enable the stabilized SIR of the soldered test board to be determined.