Abstract: An additive manufacturing system has an optics assembly to direct laser energy toward a build surface to fuse a portion of a precursor material on the build surface. An optics shield of the additive manufacturing system has a debris shield including an optical window. The optical window permits laser energy to pass through the debris shield and prevents fusion products released during fusion of the precursor material from contacting a portion of the optics assembly. The optics shield has a gas flow passage between the optical window and the build surface. The gas flow passage directs a flow of gas away from the optical window to resist movement of the fusion products through the gas flow passage toward the debris shield.

Abstract: A carbon monoxide (CO) boiler or steam generator having a water cooled CO boiler floor with screen gas distribution inlet to enhance distribution of CO gas in a CO boiler. Either the front or rear wall tubes of the steam generator form an integral screen and the tubes continue, forming a membraned, gas tight enclosure. The floor has a “knee” to redirect the incoming waste CO gas up into the integral screen. The screen may be provided with tube erosion shields to prevent erosion of the screen tubes and to control the distribution of waste gas across the plan area of the furnace.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4?-oxydianiline.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline.

Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4?-oxydianiline. The circuit board does not have an adhesive layer between the first imaged metal layer and the polyimide coverlay.

Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay comprising a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine. An adhesive layer is not present between the first imaged metal layer and the first polyimide coverlay.

Abstract: The present disclosure is directed to a circuit board having a first polyimide coverlay and a second polyimide coverlay derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine or 100 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2?-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4?-oxydianiline, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply having a polyimide derived from 80 to 90 mole % 3,3?,4,4?-biphenyl tetracarboxylic dianhydride, 10 to 20 mole 4,4?-oxydiphthalic anhydride and 100 mole % 2,2?-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer, a fourth imaged metal layer.

Abstract: A carbon monoxide (CO) boiler or steam generator having a water cooled CO boiler floor with screen gas distribution inlet to enhance distribution of CO gas in a CO boiler. Either the front or rear wall tubes of the steam generator form an integral screen and the tubes continue, forming a membraned, gas tight enclosure. The floor has a “knee” to redirect the incoming waste CO gas up into the integral screen. The screen may be provided with tube erosion shields to prevent erosion of the screen tubes and to control the distribution of waste gas across the plan area of the furnace.

Abstract: A radiant synthesis gas (syngas) cooler used to contain and cool the synthesis gas produced by a coal gasification process used in an IGCC power plant employs a compact radial platen arrangement which is less prone to fouling and/or plugging issues.

Abstract: A combustion air system particularly useful for Kraft process recovery boilers or soda process recovery boilers has a level of liquor air ports located above the black liquor guns, and multiple levels of tertiary air formed by substantially vertically aligned tertiary air ports located above the black liquor guns. The liquor air ports and the tertiary air ports are on the same opposing walls of the furnace and are substantially vertically aligned with air ports in the same wall at different levels. The liquor air ports are located just above the black liquor guns, within a range of about ½ foot to about four feet. The tertiary air ports are laterally offset with respect to the tertiary air ports on the opposing wall of the furnace.

Abstract: A bent layered structure is disclosed having a top conductive layer and a dielectric layer. The dielectric layer is a polyimide derived from at least 70 mole percent aromatic dianhydride based upon total dianhydride content of the polyimide and at least 70 mole percent aromatic diamine based upon total diamine content of the polyimide. The bent layered structure has a radius of at least 2 mm and a bend angle of at least 45 degrees at least once along a longitudinal or at least once parallel to the longitudinal axis or both and maintains a 150 to 350 V/micron breakdown voltage.

Abstract: A light emitting diode system is disclosed having a bent layered structure conformed to a least a portion of a self-supporting three dimensional heat sink and maintains a breakdown voltage from 150 to 350 V/micron. The bent layered structure has an electrical circuit, a dielectric layer and at least one LED package, LED chip on board or mixtures thereof attached to the electrical circuit. The dielectric layer is a polyimide derived from at least 70 mole percent aromatic dianhydride based upon total dianhydride content of the polyimide and at least 70 mole percent aromatic diamine based upon total diamine content of the polyimide.

Abstract: This invention utilizes atomic layer deposition (ALD) to deposit a layer of a material (e.g., aluminum oxide) as a passivation and adhesion enhancement layer on a piezoelectric layer and an interdigitated transducer(s) (IDT(s)) of a surface acoustic wave (SAW) filter and also utilizes a photosensitive polymer layer (e.g., epoxy dry film) for photodefining a cavity for SAW filter fabrication. The ALD layer serves to protect the IDTs from possible corrosion caused by either the polymer layer and/or moisture and at same time provide for stable operation of the SAW filter without a signal shift occurring by protection of the piezoelectric layer. The cavity, having walls formed by the photosensitive polymer, provides for a SAW fabrication process that is simple and cost effective.

Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.

Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.

Abstract: The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.

Abstract: A combustion air system particularly useful for Kraft process recovery boilers or soda process recovery boilers has a level of liquor air ports located above the black liquor guns, and multiple levels of tertiary air formed by substantially vertically aligned tertiary air ports located above the black liquor guns. The liquor air ports and the tertiary air ports are on the same opposing walls of the furnace and are substantially vertically aligned with air ports in the same wall at different levels. The liquor air ports are located just above the black liquor guns, within a range of about ½ foot to about four feet. The tertiary air ports are laterally offset with respect to the tertiary air ports on the opposing wall of the furnace.

Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.

Abstract: A radiant synthesis gas (syngas) cooler used to contain and cool the synthesis gas produced by a coal gasification process used in an IGCC power plant employs a compact radial platen arrangement which is less prone to fouling and/or plugging issues.