Patents by Inventor Richard Aaron Ledesma

Richard Aaron Ledesma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chambered metal electrodeposition system for semiconductor substrates
    Patent number: 8012319
    Abstract: A multi-chambered system for electroplating metal layers on a semiconductor substrate. The system comprises a fluid reservoir having at least a first chamber and a second chamber. A cathode is located in the first chamber, an anode is located in the second chamber, and a shield is located between the cathode and anode. The cathode is configured to be electrically coupled to a semiconductor substrate locatable in the first chamber. The anode is configured to oppose a first major surface of the semiconductor substrate. The shield is configured to deter electrolytic fluid communication between the first and second chamber, other than through predefined openings in the shield.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: September 6, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Nishath Yasmeen, Richard Aaron Ledesma
  • MULTI-CHAMBERED METAL ELECTRODEPOSITION SYSTEM FOR SEMICONDUCTOR SUBSTRATES
    Publication number: 20090127122
    Abstract: A multi-chambered system for electroplating metal layers on a semiconductor substrate. The system comprises a fluid reservoir having at least a first chamber and a second chamber. A cathode is located in the first chamber, an anode is located in the second chamber, and a shield is located between the cathode and anode. The cathode is configured to be electrically coupled to a semiconductor substrate locatable in the first chamber. The anode is configured to oppose a first major surface of the semiconductor substrate. The shield is configured to deter electrolytic fluid communication between the first and second chamber, other than though predefined openings in the shield.
    Type: Application
    Filed: November 21, 2007
    Publication date: May 21, 2009
    Applicant: Texas Instruments Incorporated
    Inventors: Nishath Yasmeen, Richard Aaron Ledesma