Abstract: A lithography apparatus includes a projection system configured to project a radiation beam onto a substrate, a detector configured to inspect the substrate, and a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector. The detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam.

Abstract: A lithography apparatus includes a projection system configured to project a radiation beam onto a substrate, a detector configured to inspect the substrate, and a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector. The detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam.

Abstract: A lithography apparatus includes a projection system configured to project a radiation beam onto a substrate, a detector configured to inspect the substrate, and a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector. The detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam.

Abstract: A lithographic apparatus is provided. The lithographic apparatus includes a radiation source configured to provide radiation, an array of optical light engines, and a substrate table that supports a substrate. Each of the optical light engines includes an array of individually controllable elements arranged and constructed to receive and to pattern the radiation and projection optics configured to receive the patterned radiation and to project the patterned radiation onto the substrate. The substrate table is arranged and constructed to move relative to the array of optical light engines during exposure of the substrate to the patterned radiation.

Abstract: A lithographic apparatus is provided. The lithographic apparatus includes a radiation source configured to provide radiation, an array of optical light engines, and a substrate table that supports a substrate. Each of the optical light engines includes an array of individually controllable elements arranged and constructed to receive and to pattern the radiation and projection optics configured to receive the patterned radiation and to project the patterned radiation onto the substrate. The substrate table is arranged and constructed to move relative to the array of optical light engines during exposure of the substrate to the patterned radiation.

Abstract: A lithographic apparatus in which alignment marks on the substrate are inspected during the exposure of the substrate to optimize the exposure conditions.

Abstract: A lithographic projection apparatus having at least two substrate holders is controlled to reduce effects of differences in images caused by differences between the two substrate holders. The apparatus includes an internal or external detector that identifies a substrate and associates it with a respective one of the substrate holders. A controller ensures that either the substrate is processed on the appropriate holder or that correction is applied to the imaging. In an alternate embodiment, the substrate is associated with a respective one of the substrate holders and is consistently processed using that substrate holder without further identification steps.

Abstract: A lithographic projection apparatus having at least two substrate holders is controlled to reduce effects of differences in images caused by differences between the two substrate holders. The apparatus includes an internal or external detector that identifies a substrate and associates it with a respective one of the substrate holders. A controller ensures that either the substrate is processed on the appropriate holder or that correction is applied to the imaging. In an alternate embodiment, the substrate is associated with a respective one of the substrate holders and is consistently processed using that substrate holder without further identification steps.

Abstract: An arrangement is discussed for producing free atoms of a substance for atomic spectroscopy purposes comprising an oven and an oven element, which contains the substance to be examined, which oven is surrounded by cooling means which, during the spectroscopic measurements, cool the oven wall and which must have a temperature of at least 30.degree. C.

Abstract: A method of transferring and injecting a liquid sample, by supplying an inert gas to an injection needle after normal injection has taken place by the action of a plunger. The injection syringe is constructed to allow the inert gas to pass freely even when the needle is fully depressed, to remove any drop clinging to the tip or needle inner wall.

Abstract: A furnace for heating a sample of a substance to produce free atoms for atomic spectroscopy wherein an unequal temperature distribution is created in a sample holding element and a protective gas flows through the sample holding element in the direction of increasing temperature to reduce the tendency of free atoms to condense on surfaces of the sample holding element.