Abstract: A method of manufacturing a mold and a mold for forming an intercoupling component of the type used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. A plurality of plates are provided, each plate including an array of holes arranged in a pattern corresponding to the array of electrical connection regions of the first substrate. A base is formed by stacking the plates with the holes substantially aligned. Pins are inserted into apertures formed in the base by the aligned holes. A housing is assembled with the base, pins, at least one sidewall, and a cover, the housing including a substantially enclosed cavity, the housing also including at least one opening to enable injection of molten material into the cavity.