Patents by Inventor Richard Amold

Richard Amold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machine
    Publication number: 20030116346
    Abstract: An inexpensive and accurate probe card for testing integrated circuits such as DSPs and the like which have solder ball contact points as manufactured by using a commercially available wire bonding machine. Conductive members or stud bumps are deposited or bonded to conductive pads formed on an insulating substrate. According to one embodiment, three stud bumps are formed on each pad to create an interconnecting nest to receive these solder ball contacts.
    Type: Application
    Filed: December 21, 2001
    Publication date: June 26, 2003
    Inventors: James Allam Forster, Reynaldo M. Rincon, Richard Amold, Lester Wilson