Abstract: A plasma processing apparatus for processing a substrate using a plasma, comprising: a process chamber in which the processing takes place; a plasma source for providing a plasma to the process chamber; a substrate mount within the process chamber for holding the substrate, the substrate mount comprising a surface having a plurality of apertures.

Abstract: A plasma processing apparatus for processing a substrate using a plasma, comprising: a process chamber in which the processing takes place; a plasma source for providing a plasma to the process chamber; a substrate mount within the process chamber for holding the substrate, the substrate mount comprising a surface having a plurality of apertures.

Abstract: A plasma deposition method in which a cover layer is deposited onto the internal walls of an empty plasma chamber by plasma deposition of a precursor mixture comprising (i) one or more hydrocarbon compounds of formula (A), or (ii) one or more C1-C3 alkane, C2-C3 alkene or C2-C3 alkyne compounds: (Formula (A)) wherein: Z1 represents C1-C3 alkyl or C2-C3 alkenyl; Z2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and Z6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl.

Abstract: The present invention describes optical discs on which polymer molecules can be analyzed. There is a method for determining a plurality of characteristics of a target molecule, the target molecule being localized on an optical substrate comprising pits and lands, comprising the steps of: (i) carrying out a series of reactions to interrogate different defined characteristics of the target molecule, wherein each of the reactions occurs in a distinct pit; (ii) treating the optical substrate to modify either those pits where a reaction has occurred, or alternatively, those pits where a reaction has not occurred, to alter the reflective characteristics of the pits; and (iii) measuring reflectivity within the pits, to thereby determine different characteristics of the target.