Abstract: Disclosed is a composition, in particular to a building material for an additive manufacturing process, wherein the composition is treated by heat. Further, the present invention is directed to a process for the manufacturing of the inventive composition and to a device comprising the inventive composition and the use of the inventive composition.

Abstract: A method of manufacturing a permanent magnet, including providing a powder composition, of which a first fraction includes ferromagnetic metal particles and a second fraction includes thermoplastic polymer particles; using the powder composition in a powder-bed based additive manufacturing process to form a part including ferromagnetic metal particles embedded in a fused thermoplastic polymer body; and subsequently conferring magnetism on the built part by arranging the finished part in a magnetic field.

Abstract: Disclosed is an additive manufacture material made from polymers and designed to be biodegradeable in a landfill or oceanic environment. The material may be made of bio-based polymers made from caster beans, cellulose, corn, starch, sugarcane, etc., such as nylon 11, bio-based polyethylene, polylactic acid, polyhydroxyalkanote, polyvinyl acetate, etc., to which is added microorganism, such as a bacteria, an enzyme or other additive to facilitate/accelerate the decomposition of the polymer in an environment where the object made through AM has been disposed, e.g., discarded after useful life. The microorganism or other additives that facilitate/accelerate the decomposition of polymers can also be added to petroleum-based, non bio-based polymers.

Abstract: Disclosed is an additive manufacture material made from polymers and designed to be biodegradable in a landfill or oceanic environment. The material may be made of bio-based polymers made from caster beans, cellulose, corn, starch, sugarcane, etc., such as nylon 11, bio-based polyethylene, polylactic acid, polyhydroxyalkanote, polyvinyl acetate, etc., to which is added microorganism, such as a bacteria, an enzyme or other additive to facilitate/accelerate the decomposition of the polymer in an environment where the object made through AM has been disposed, e.g., discarded after useful life. The microorganism or other additives that facilitate/accelerate the decomposition of polymers can also be added to petroleum-based, non bio-based polymers.

Abstract: Disclosed is a composition, in particular to a building material for an additive manufacturing process, wherein the composition is treated by heat. Further, the present invention is directed to a process for the manufacturing of the inventive composition and to a device comprising the inventive composition and the use of the inventive composition.

Abstract: Disclosed is a plastic powder for use as a building material for the additive manufacturing of a three-dimensional object by selective solidification of the building material at the points corresponding to the cross-section of the three-dimensional object in the respective layer by exposure to radiation, wherein the plastic powder comprises polymer-based particles and an additive for imparting biodegradability in an amount of 0.05 to 5% by weight based on the weight of the polymeric components in the polymer-based powder. Further disclosed is a method for the production of such powder, methods for the production of three dimensional objects using such powder as well as three dimensional objects, which have been prepared accordingly, as well as the use of corresponding additives to impart biodegradability to three dimensional objects, which have been prepared accordingly.

Abstract: Disclosed is an additive manufacture material made from polymers and designed to be biodegradeable in a landfill or oceanic environment. The material may be made of bio-based polymers made from caster beans, cellulose, corn, starch, sugarcane, etc., such as nylon 11, bio-based polyethylene, polylactic acid, polyhydroxyalkanote, polyvinyl acetate, etc., to which is added microorganism, such as a bacteria, an enzyme or other additive to facilitate/accelerate the decomposition of the polymer in an environment where the object made through AM has been disposed, e.g., discarded after useful life. The microorganism or other additives that facilitate/accelerate the decomposition of polymers can also be added to petroleum-based, non bio-based polymers.

Abstract: A method of manufacturing a permanent magnet, including providing a powder composition, of which a first fraction includes ferromagnetic metal particles and a second fraction includes thermoplastic polymer particles; using the powder composition in a powder-bed based additive manufacturing process to form a part including ferromagnetic metal particles embedded in a fused thermoplastic polymer body; and subsequently conferring magnetism on the built part by arranging the finished part in a magnetic field.

Abstract: A powder for use in selective laser sintering, from which prototype articles and masters for molds may be formed, is disclosed. The powder is formed by spray drying a polymer emulsion to yield a distribution of particles of substantially spherical shape. The powder is then air classified to remove excessively small particles from the distribution; the powder may also be screened to remove large particles therefrom, as well. The resulting distribution of particle sizes, by volume, preferably has a mean particle size of between about 20.mu. and about 50.mu., with preferably less than about 5% (by volume) of its particles with a size of less than about 15.mu. and less than about 2% (by volume) of its particles with a size of greater than about 75.mu.. The powder is subjected to selective laser sintering to produce an article of approximately 55% to 75% of theoretical density. The article may be used as a prototype article or part, or as a pattern or master for a mold.

Abstract: A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.

Abstract: A method of fabricating articles, such as prototype parts and prototype tooling for injection molding, is disclosed. The method begins with the fabrication of the article in a "green" state by the selective laser sintering, or another additive thermal process, applied to a composite powder, preferably a powder of metal particles coated with a thermoplastic polymer. Both the green article and also an aqueous emulsion of a thermosetting material are then preheated to a temperature below the glass transition temperature of the thermoplastic polymer, and the green article is then infiltrated with the aqueous emulsion. The thermosetting material may be a thermosetting polymer with an appropriate cross-linking agent, or may be a cross-linking agent that will react with the thermoplastic binder polymer. After infiltration, the article is dried, and a rigid skeleton of a thermosetting material is now present within the structure of the article. Further processing may now be performed.

Abstract: The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Abstract: A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.

Abstract: A multilayer, high yield and high density integrated circuit (IC) chips interposer and the method of manufacture therefore. A thin polyimide film is circuitized with copper on both sides. One side may be reserved for power or ground with the opposite side being a signal plane. Adhesive is laminated over both sides covering the circuit patterns. Vias are drilled through at least one adhesive surface, and through the polyimide film. Metal (copper) is blanket sputtered to coat the via walls. Polymer Metal Conductive (PMC) paste is screened to at least partially fill the vias. The Blanket metal is sub-etched using the screened PMC as a mask. Layers are stacked to form the interposer with the PMC bonding the stacked layers together and electrically interconnecting between layers.

Abstract: A multilayer, high yield and high density integrated circuit (IC) chips interposer and the method of manufacture therefore. A thin polyimide film is circuitized with copper on both sides. One side may be reserved for power or ground with the opposite side being a signal plane. Adhesive is laminated over both sides covering the circuit patterns. Vias are drilled through at least one adhesive surface, and through the polyimide film. Metal (copper) is blanket sputtered to coat the via walls. Polymer Metal Conductive (PMC) paste is screened to at least partially fill the vias. The Blanket metal is sub-etched using the screened PMC as a mask. Layers are stacked to form the interposer with the PMC bonding the stacked layers together and electrically interconnecting between layers.

Abstract: A method of replacing IC chip package wiring having an interposer comprising removing an interposer having a plurality of adhesively laminated interposer layers from the package, delaminating and replacing at least one interposer layer with a corrected interposer layer, relaminating the interposer layers with adhesive thus producing a replacement interposer and remounting the replacement interposer to the IC chip package.

Abstract: A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

Abstract: A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.