Patents by Inventor Richard Beanland

Richard Beanland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140143355
    Abstract: The present invention provides a method, apparatus and computer readable medium for transmitting a video text message including receiving a text message via a text messaging application on a first mobile device. Based on the input, the next steps are determining a search query term for searching one or more libraries of video clips and accessing the one or more libraries of video clips using the search query term to retrieve a plurality of video clips. Thereupon, further steps are presenting the plurality of video clips to the user in the text message application and receiving a user selection of one of the plurality of video clips. As such, the method, apparatus and computer readable medium combines the selected video clip with the text message to generate the video message and provides for transmission to the second mobile device for viewing thereon.
    Type: Application
    Filed: June 14, 2013
    Publication date: May 22, 2014
    Inventors: Bert Berdis, Daniel Collins, Evan Frankfort, Daniel Leeb, Richard Beanland
  • Patent number: 8319236
    Abstract: A metallization on a semiconductor substrate is disclosed in the form of a laminate comprising a plurality of layers of a “conducting” metallization for providing electrical conductivity, interspersed with a plurality of layers of another metallization. By providing many layers the thickness of each individual layer can be reduced. Reduction in thickness of each layer leads to a reduction in grain size and a consequent reduction in creep over the lifetime of a device.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: November 27, 2012
    Assignee: Oclaro Technology Limited
    Inventors: Richard Beanland, Stephen Jones, Ian Juland
  • Publication number: 20080198885
    Abstract: A metallization on a semiconductor substrate is disclosed in the form of a laminate comprising a plurality of layers of a “conducting” metallization for providing electrical conductivity, interspersed with a plurality of layers of another metallization. By providing many layers the thickness of each individual layer can be reduced. Reduction in thickness of each layer leads to a reduction in grain size and a consequent reduction in creep over the lifetime of a device.
    Type: Application
    Filed: February 8, 2008
    Publication date: August 21, 2008
    Inventors: Richard BEANLAND, Stephen Jones, Ian Juland
  • Patent number: 7072441
    Abstract: The invention is concerned with a method f alignment for aligning crystal planes of a wafer substrate (40) to lithographic features thereon, the method characterized in that it includes the steps of: (a) measuring angular orientation of a peripheral flat (200) of the substrate (40); (b) measuring a crystallographic plane orientation of the substrate (40); (c) determining an error angle (?) between the annular orientation of the flat (200) and the crystallographic orientation; (d) angularly registering to the flat (200) in a lithographic tool; (e) rotating the substrate (40) by the error angle (?); and (f) defining one or more feature layers on the substrate (40) using the lithographic tool, thereby angularly aligning the one or more feature layers to the crystallographic plane orientation.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: July 4, 2006
    Assignee: Bookham Technology, plc
    Inventor: Richard Beanland
  • Patent number: 6977986
    Abstract: The invention provides an apparatus (10, 300) incorporating a lithographic tool (20) for printing a pattern from a mask (35) onto a substrate, for example a wafer (190), together with a substrate angle measuring tool (100, 310) employing X-ray diffraction techniques for determining substrate crystallographic orientation. The apparatus (10, 310) is calibrated so that the mask (35) is correctly angularly orientated with respect to the measuring tool (100, 310). When a new substrate (190) is loaded into the apparatus (10, 310) for having the pattern from the mask (35) printed thereonto, the apparatus (10, 300) angularly aligns the substrate (190) relative to the measuring tool (100, 310), thereby also aligning it angularly to the mask (35).
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: December 20, 2005
    Assignee: Bookham Technology PLC
    Inventors: Richard Beanland, Derrick Gordon Hart
  • Publication number: 20040071262
    Abstract: The invention is concerned with a method f alignment for aligning crystal planes of a wafer substrate (40) to lithographic features thereon, the method characterised in that it includes the steps of: (a) measuring angular orientation of a peripheral flat (200) of the substrate (40); (b) measuring a crystallographic plane orientation of the substrate (40); (c) determining an error angle (&phgr;) between the annular orientation of the flat (200) and the crystallographic orientation; (d) angularly registering to the flat (200) in a lithographic tool; (e) rotating the substrate (40) by the error angle (&phgr;); and (f) defining one or more feature layers on the substrate (40) using the lithographic tool, thereby angularly aligning the one or more feature layers to the crystallographic plane orientation.
    Type: Application
    Filed: December 2, 2003
    Publication date: April 15, 2004
    Inventor: Richard Beanland