Patents by Inventor Richard Beaudry

Richard Beaudry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240302736
    Abstract: A wafer including a mask on one face and at least one layer on an opposite face, wherein the mask has at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer is described. Also described is a method of preparing a pellicle, the method including: providing a wafer having a mask on one face and at least one layer on an opposite face, defining a scribeline in the mask, and selectively removing a portion of the at least one layer which at least partially overlies the scribeline as well as a method of preparing a pellicle, the method including: providing a pellicle core, and removing at least some material from at least one face of the pellicle core in a non-oxidizing environment. In any aspect, the pellicle may include a metal nitride layer.
    Type: Application
    Filed: March 27, 2024
    Publication date: September 12, 2024
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Dennis DE GRAAF, Richard BEAUDRY, Maxime BIRON, Paul JANSSEN, Thijs KATER, Kevin KORNELSEN, Michael Alfred Josephus KUIJKEN, Jan Hendrik Willem KUNTZEL, Stephane MARTEL, Maxim Aleksandrovich NASALEVICH, Guido SALMASO, Pieter-Jan VAN ZWOL
  • Publication number: 20240183663
    Abstract: An optical ring resonator-based gyroscope includes a photonic integrated circuit (PIC) chip including a plurality of optical elements, the plurality of optical elements including a resonator ring; and a printed circuit board including a plurality of electrical components, the photonic integrated circuit being mounted on a surface of the printed circuit board, the photonic integrated circuit and the printed circuit board being electrically connected. A photonic integrated circuit (PIC) chip including a substrate; a dielectric layer; a first waveguide layer forming at least: a ring resonator and reflector portions; a second waveguide layer forming at least: vertical Bragg grating couplers disposed over one of the plurality of reflector portions, a chip waveguide; a magneto-optic layer encapsulated in the dielectric layer; and a metal layer forming a plurality of metal connection pads and a plurality of wire traces for electrically connecting the PIC chip to electronic components.
    Type: Application
    Filed: January 11, 2022
    Publication date: June 6, 2024
    Inventors: Kazem ZANDI, Richard BEAUDRY
  • Patent number: 11977326
    Abstract: A wafer including a mask on one face and at least one layer on an opposite face, wherein the mask has at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer is described. Also described is a method of preparing a pellicle, the method including: providing a wafer having a mask on one face and at least one layer on an opposite face, defining a scribeline in the mask, and selectively removing a portion of the at least one layer which at least partially overlies the scribeline as well as a method of preparing a pellicle, the method including: providing a pellicle core, and removing at least some material from at least one face of the pellicle core in a non-oxidising environment. In any aspect, the pellicle may include a metal nitride layer.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: May 7, 2024
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Dennis De Graaf, Richard Beaudry, Maxime Biron, Paul Janssen, Thijs Kater, Kevin Kornelsen, Michael Alfred Josephus Kuijken, Jan Hendrik Willem Kuntzel, Stephane Martel, Maxim Aleksandrovich Nasalevich, Guido Salmaso, Pieter-Jan Van Zwol
  • Publication number: 20240143957
    Abstract: Various systems and methods for imprinting a unique identifier on a semiconductor die are disclosed herein. Example embodiments involve receiving a substrate at a photolithography station, the substrate including a photosensitive layer and an area for forming semiconductor dies, forming circuits on the substrate using a photolithography mask, imprinting a unique identifier on each semiconductor die on the substrate using a digital photomask and removing the substrate containing the semiconductor dies containing the circuits and the unique identifiers from the photolithography station. In some embodiments, each unique identifier is associated with a unique record for recording characteristics of the substrate, of the semiconductor die and of the unique identifier. In some embodiments, the digital photomask includes dynamically-controlled pixels, controllable to define a unique pattern for each unique identifier. In some embodiments, the unique identifier is a two-dimensional code.
    Type: Application
    Filed: January 5, 2023
    Publication date: May 2, 2024
    Applicant: Digitho Technologies Inc.
    Inventors: Richard BEAUDRY, Cédric Canu, Maurice Delafosse
  • Patent number: 11934091
    Abstract: A photolithography mask (10) is provided, said photolithography mask (10) including a plate (15) or an empty frame matrix, a surface of the plate (15) or empty frame matrix including an array of micro-pixels (20), wherein each micro-pixel (20) is independently controllable using an on-board micro-controller (25) in such a manner that a pattern can be generated with the array of micro-pixels (20).
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: March 19, 2024
    Assignee: TECHNOLOGIES DIGITHO INC.
    Inventor: Richard Beaudry
  • Publication number: 20240085776
    Abstract: A photolithography mask (10) is provided, said photolithography mask (10) including a plate (15) or an empty frame matrix, a surface of the plate (15) or empty frame matrix including an array of micro-pixels (20), wherein each micro-pixel (20) is independently controllable using an on-board micro-controller (25) in such a manner that a pattern can be generated with the array of micro-pixels (20).
    Type: Application
    Filed: March 31, 2022
    Publication date: March 14, 2024
    Inventor: Richard BEAUDRY
  • Publication number: 20210240070
    Abstract: A wafer including a mask on one face and at least one layer on an opposite face, wherein the mask has at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer is described. Also described is a method of preparing a pellicle, the method including: providing a wafer having a mask on one face and at least one layer on an opposite face, defining a scribeline in the mask, and selectively removing a portion of the at least one layer which at least partially overlies the scribeline as well as a method of preparing a pellicle, the method including: providing a pellicle core, and removing at least some material from at least one face of the pellicle core in a non-oxidising environment. In any aspect, the pellicle may include a metal nitride layer.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 5, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Dennis DE GRAAF, Richard BEAUDRY, Maxime BIRON, Paul JANSSEN, Thijs KATER, Kevin KORNELSEN, Michael Alfred Josephus KUIJKEN, Jan Hendrik Willem KUNTZEL, Stephane MARTEL, Maxim Aleksandrovich NASALEVICH, Guido SALMASO, Pieter-Jan VAN ZWOL
  • Publication number: 20120153839
    Abstract: A device and method that automatically corrects the color of a dome light display device. An dome light display device may include one or more colored light emitting diodes (LEDs) arranged in a row, a photodetector disposed with the one or more LEDs in the row and a measurement circuit is configured to receive an electrical signal from the photodetector and compare the electrical signal to a reference signal associated with an intensity of light for a particular color of light and adjust the intensity of light emitted from the one or more LEDs based on the reference value.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Applicant: SIMPLEXGRINNELL LP
    Inventors: Joseph D. Farley, Carl J. Silkey, Richard Beaudry
  • Publication number: 20090242512
    Abstract: In a method of performing an anisotropic etch on a substrate in an inductively coupled plasma etch chamber, at least three cycles of a procedure consisting essentially of the four following steps are performed: a. depositing a protective polymer on a patterned substrate; b. performing a first low pressure etch to partially remove the deposited protective polymer at a pressure less than 40 mTorr; c. performing a high pressure etch at a pressure between between 40 mT and 1000 mT to form a portion of a trench in the substrate; and d. performing a second low pressure etch at a pressure less than 40 MTorr to reduce surface roughness. This method permits the fabrication of deep trenches with reduced surface roughness.
    Type: Application
    Filed: March 24, 2009
    Publication date: October 1, 2009
    Applicant: DALSA SEMICONDUCTOR INC.
    Inventor: Richard Beaudry
  • Patent number: 7439093
    Abstract: A method of making an etch structure in a substrate involves the steps of providing a mask on a substrate with a pattern that leaves at least one opening leaving the substrate in direct contact with the ambient, performing an isotropic or quasi-isotropic etch through a mask to create a cavity under the mask, which mask is left behind as a suspended membrane above the cavity; and performing a subsequent anisotropic etch that etches anisotropically the pattern of the mask in the bottom of the cavity.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: October 21, 2008
    Assignee: DALSA Semiconductor Inc.
    Inventor: Richard Beaudry
  • Publication number: 20070065967
    Abstract: A method of making an etch structure in a substrate involves the steps of providing a mask on a substrate with a pattern that leaves at least one opening leaving the substrate in direct contact with the ambient, performing an isotropic or quasi-isotropic etch through a mask to create a cavity under the mask, which mask is left behind as a suspended membrane above the cavity; and performing a subsequent anisotropic etch that etches anisotropically the pattern of the mask in the bottom of the cavity.
    Type: Application
    Filed: September 16, 2005
    Publication date: March 22, 2007
    Applicant: DALSA Semiconductor Inc.
    Inventor: Richard Beaudry