Patents by Inventor Richard Bischel

Richard Bischel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing a thick film metallization on an aluminum nitride substrate
    Patent number: 6444297
    Abstract: A metallization layer structure is applied to an aluminum nitride substrate by the application of an intermediate buffer layer of either silicon monoxide or silicon dioxide. Conventional oxide bonding conductor and resistor formulations can then be applied and readily bonded to the intermediate buffer layer resulting in thermally and mechanically stable structure on the surface of the aluminum nitride substrate.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: September 3, 2002
    Assignee: Electro Technik Industries, Inc.
    Inventor: Richard Bischel