Abstract: An electronic device with a sealing layer is disclosed. The sealing layer may include several enhancements designed to improve the overall sealing performance. For instance, the sealing layer may include an adhesive material and several particles embedded in the adhesive material. The embedded particles may include liquid-activated particles that respond to liquid exposure. In some instances, the liquid-activated particles absorb the liquid. Additionally, the liquid-activated particles may expand and fill/cover areas previously occupied by the sealing layer or another structure of the electronic device. Further, the liquid-activated particles may adhere to one or more structures of the electronic device, thereby providing the sealing layer with sealing properties.

Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

Abstract: A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of the heat sink and a second zone formed on a second area of the heat sink. The processor may overlap or overlie the first zone, with the second zone generally outside the footprint of the processor and optionally surrounding the processor's footprint. The first zone may have a generally smooth surface, while the second zone may have a surface rougher than the first zone. The first zone may be finished to a specific smoothness while the second zone may be finished to second particular smoothness that is generally less than the first zone.

Abstract: An apparatus for cutting a corrugated metal sheet is disclosed. The apparatus includes a table, a clamp assembly, and a cutting tool. The clamp assembly has a lower frame and an upper frame. A lower vibration absorbing pad is supported by the lower frame, and an upper vibration absorbing pad is secured to the upper frame such that the upper vibration absorbing pad faces the lower vibration absorbing pad. In an open position the lower and upper vibration absorbing pads are separated to permit the corrugated sheet metal to be positioned therebetween and in a closed position the corrugated metal sheet is clamped between the lower and upper vibration absorbing pads with at least one of the lower and upper vibration absorbing pads substantially conforming to the contour of an adjacent surface of the corrugated metal sheet.

Abstract: A suspension assembly for supporting a read/write head/slider assembly adjacent to a rotating storage disk with dynamically adjustable flying height for use within a hard disk drive is provided. The suspension assembly includes a generally elongated loadbeam that has a baseplate defined at a first end thereof and a gimbaled flexure portion defined at a second end thereof. The flexure portion includes a pair of flexure legs and a flexure tongue. The pair of flexure legs extend from the flexure tongue and each leg attaches to an opposite side of the loadbeam. The flexure tongue generally provides a mounting surface for the read/write head/slider assembly. Strips of thermal-expansion material are attached to the flexure portion. These strips are connected to a power source via a power conductor. When the strips are energized, they expand and deform a portion of the flexure portion.