Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: Fingerprint sensing circuit packages and methods of making such packages may comprise a first substrate having a top side and a bottom side; the top side comprising a fingerprint image sensing side over which a user's fingerprint is swiped; the bottom side comprising a metal layer forming a fingerprint sensing circuit image sensor structure; and a sensor control circuit housed in a sensor control circuit package mounted on the metal layer. The sensor control circuit may comprise an integrated circuit die contained within the sensor control circuit package. The fingerprint sensing circuit package may also have a second substrate attached to the bottom side of the first substrate having a second substrate bottom side on which is placed connector members connecting the fingerprint sensing circuit package to a device using a fingerprint image generated from the fingerprint sensing circuitry contained in the fingerprint sensing circuitry package.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within a housing adaptable for use in an electronic device.

Abstract: A biometric sensor apparatus and method are disclosed, which may comprise a flexible substrate comprising a first side surface and a second side surface opposing the first side surface; a biometric sensor portion comprising biometric image sensing elements formed on the second side surface forming at least part of a biometric sensor array sensing capacitively induced changes induced by a biometric in the vicinity of the biometric image sensing elements; a biometric sensor controller integrated circuit mounted to the flexible substrate on one of the first side surface and the second side surface of the flexible substrate; an edge surface of the flexible substrate including at least one conductively plated perforation in the flexible substrate; and an electro-static discharge element formed on or as part of the flexible substrate and electrically connected to the at least one conductively plated perforation.

Abstract: A biometric sensor apparatus and method are disclosed, which may comprise a flexible substrate comprising a first side surface and a second side surface opposing the first side surface; a biometric sensor portion comprising biometric image sensing elements formed on the second side surface forming at least part of a biometric sensor array sensing capacitively induced changes induced by a biometric in the vicinity of the biometric image sensing elements; a biometric sensor controller integrated circuit mounted to the flexible substrate on one of the first side surface and the second side surface of the flexible substrate; an edge surface of the flexible substrate including at least one conductively plated perforation in the flexible substrate; and an electro-static discharge element formed on or as part of the flexible substrate and electrically connected to the at least one conductively plated perforation.

Abstract: Embodiments of the invention provide a substrate and a method for constructing a substrate with electrostatic discharge protection. The substrate includes an edge surface with at least one plated castellation capable of conducting electrostatic discharge. The at least one plated castellation is connected to a circuit trace on at least one of the bottom surface and the top surface of the substrate. The method includes punching holes along at least a portion of a perimeter of each of a plurality of substrates in a substrate array, plating the holes with a conductive material, and cutting each of the plurality of substrates along cut lines that bisect at least some of the holes.

Abstract: A method and system is disclosed which may comprise a biometric object sensor that may comprise at least one conductive layer formed from a transparent or translucent material and formed in at least one of on, in or under an outer layer of a user device housing; at least one of a transmitter trace and at least one of a receiver trace formed from the at least one of the transparent or translucent material in the conductive layer. The transparent or translucent material may form at least a portion of a touch screen display on a user device. The at least one of a transmitter trace and at least one of a receiver trace may comprise one of a plurality of transmitter traces and a receiver trace and a plurality of receiver traces and a transmitter trace or a plurality of transmitter traces and a plurality of receiver traces.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within a housing adaptable for use in an electronic device.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing arc also disclosed.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: A fingerprint sensor in accordance with the invention includes a non-conductive substrate providing a first surface onto which a user can apply a fingerprint to be sensed. A sensor circuit is applied to a second surface of the non-conductive substrate opposite the first surface to sense a fingerprint when juxtaposed proximally thereto. An electrostatic discharge conductor is applied to the non-conductive surface and is located between an area where a fingerprint is swiped and the sensor circuit. The electrostatic discharge conductor discharges electrostatic charge resulting from a user swiping a fingerprint across the first surface.

Abstract: Fingerprint sensing circuit packages and methods of making such packages may comprise a first substrate having a top side and a bottom side; the top side comprising a fingerprint image sensing side over which a user's fingerprint is swiped; the bottom side comprising a metal layer forming a fingerprint sensing circuit image sensor structure; and a sensor control circuit housed in a sensor control circuit package mounted on the metal layer. The sensor control circuit may comprise an integrated circuit die contained within the sensor control circuit package. The fingerprint sensing circuit package may also have a second substrate attached to the bottom side of the first substrate having a second substrate bottom side on which is placed connector members connecting the fingerprint sensing circuit package to a device using a fingerprint image generated from the fingerprint sensing circuitry contained in the fingerprint sensing circuitry package.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: Embodiments of the invention provide a substrate and a method for constructing a substrate with electrostatic discharge protection. The substrate includes an edge surface with at least one plated castellation capable of conducting electrostatic discharge. The at least one plated castellation is connected to a circuit trace on at least one of the bottom surface and the top surface of the substrate. The method includes punching holes along at least a portion of a perimeter of each of a plurality of substrates in a substrate array, plating the holes with a conductive material, and cutting each of the plurality of substrates along cut lines that bisect at least some of the holes.

Abstract: A fingerprint sensor in accordance with the invention includes a non-conductive substrate providing a first surface onto which a user can apply a fingerprint to be sensed. A sensor circuit is applied to a second surface of the non-conductive substrate opposite the first surface to sense a fingerprint when juxtaposed proximally thereto. An electrostatic discharge conductor is applied to the non-conductive surface and is located between an area where a fingerprint is swiped and the sensor circuit. The electrostatic discharge conductor discharges electrostatic charge resulting from a user swiping a fingerprint across the first surface.