Patents by Inventor Richard Burton CASSIDY, II

Richard Burton CASSIDY, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure having magnetic bonding between substrates
    Patent number: 10157885
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first die, and the first die includes a first magnetic pad formed over a first substrate. The package structure includes a second die, and the second die includes a second magnetic pad formed over a second substrate. The package structure also includes a hybrid bonding structure formed between the first die and the second die of the second wafer. The hybrid bonding structure includes a magnetic bonding structure which is made of the first magnetic pad and the second magnetic layer.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: December 18, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Peter Yu-Fei Huang, Richard Burton Cassidy, II, Chaochieh Tsai
  • PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    Publication number: 20180033773
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first die, and the first die includes a first magnetic pad formed over a first substrate. The package structure includes a second die, and the second die includes a second magnetic pad formed over a second substrate. The package structure also includes a hybrid bonding structure formed between the first die and the second die of the second wafer. The hybrid bonding structure includes a magnetic bonding structure which is made of the first magnetic pad and the second magnetic layer.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 1, 2018
    Inventors: Peter Yu-Fei HUANG, Richard Burton CASSIDY, II, Chaochieh TSAI