Patents by Inventor Richard C. Cook

Richard C. Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7226973
    Abstract: A thermoplastic blend suitable for blow molding comprising a branched polycarbonate and a polyester resin derived from the condensation of a) a cyclohexanedimethanol or equivalent thereof alone or with an ethylene glycol or equivalent thereof, b) together with a terephthalic acid or equivalents thereof alone or with an isophthalic acid or equivalent thereof.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: June 5, 2007
    Assignee: General Electric Company
    Inventors: Rodney W. Fonseca, Peter H. Th. Vollenberg, Richard C. Cook
  • Patent number: 6790271
    Abstract: A soy protein based adhesive useful in particleboards and other composites is formed from a mixture of soy protein isolate, a polyol plasticizer and a vegetable oil derivative. The preferred plasticizer is glycerol and the preferred vegetable oil derivative is the maleinized methyl ester of tung oil.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: September 14, 2004
    Assignee: The University of Southern Mississippi
    Inventors: Shelby F. Thames, Richard C. Cook, Sharathkumar K. Mendon
  • Publication number: 20040173306
    Abstract: A binder system made from renewable resources is used to produce particleboards. In a preferred embodiment the binder includes soy protein isolate, a plasticizer such as glycerol and a vegetable oil derivative such as maleinized methyl ester of tung oil. Particleboard is formed from a source of lignocellulose, the binder, and optionally an alkali modified soy protein and emulsified wax.
    Type: Application
    Filed: October 24, 2002
    Publication date: September 9, 2004
    Applicant: University of Southern Mississippi
    Inventors: Shelby F. Thames, Richard C. Cook, Qiang Wang, Sharathkumar K. Mendon
  • Publication number: 20040007156
    Abstract: A soy protein based adhesive useful in particleboards and other composites is formed from a mixture of soy protein isolate, a polyol plasticizer and a vegetable oil derivative. The preferred plasticizer is glycerol and the preferred vegetable oil derivative is the maleinized methyl ester of tung oil.
    Type: Application
    Filed: July 11, 2002
    Publication date: January 15, 2004
    Inventors: Shelby F. Thames, Richard C. Cook, Sharathkumar K. Mendon
  • Patent number: 5234973
    Abstract: The present invention provides a binder solution having a low solids level which provides improved tensile properties when used with reclaimed sand. This binder solution comprises an alkaline phenolic resin which is cured at ambient temperature with an ester-functional curing agent. Also provided by this invention are raw batch formulations comprising sand, a binder solution having a low solids level, and a curing agent. These raw batch formulations include embodiments wherein the low solids levels are obtained by the separate addition of a solvent. The methods for producing foundry molds and cores of this invention included those procedures wherein dilution water is used to reduce the solids contents of conventional, relatively high solids content binder solutions.
    Type: Grant
    Filed: September 12, 1991
    Date of Patent: August 10, 1993
    Assignee: Acme Resin Corporation
    Inventors: S. Raja Iyer, Calvin K. Johnson, Richard C. Cooke
  • Patent number: 5082876
    Abstract: The present invention provides a binder solution having a low solids level which provides improved tensile properties when used with reclaimed sand. This binder solution comprises an alkaline phenolic resin which is cured at ambient temperature with an ester-functional curing agent. Also provided by this invention are raw batch formulations comprising sand, a binder solution having a low solids level, and a curing agent. These raw batch formulations include embodiments wherein the low solids levels are obtained by the separate addition of a solvent. The methods for producing foundry molds and cores of this invention included those procedures wherein dilution water is used to reduce the solids contents of conventional, relatively high solids content binder solutions.
    Type: Grant
    Filed: August 16, 1990
    Date of Patent: January 21, 1992
    Assignee: Borden, Inc.
    Inventors: S. Raja Iyer, Calvin K. Johnson, Richard C. Cooke
  • Patent number: 5077323
    Abstract: A process for improving the flowability of resin coated sand which comprises the use of a flow promoter with the mixture of sand and resin. Also provided is a foundry mix comprising foundry sand, a resin binder and the flow promoter, as well as a process for making foundry cores and molds using the foundry mix. The resins are ester-curable alkaline phenolic resole resins. The flow promoter is selected from the group consisting of fatty acids, fatty alcohols, fatty amines, fatty amides and fatty alkanolamides.
    Type: Grant
    Filed: October 10, 1989
    Date of Patent: December 31, 1991
    Assignee: Acme Resin Corporation
    Inventors: Calvin K. Johnson, Richard C. Cooke, Jr., David R. Armbruster
  • Patent number: 4996249
    Abstract: A process for improving the flowability of resin coated sand which comprises the use of a fluorosurfactant with the mixture of sand and resin. Also provided is a resin binder containing a fluorosurfactant and a foundry mix comprising foundry sand, a resin binder and a fluorosurfactant. The resins used are alkaline phenolic resole resins and acid-curable resins.
    Type: Grant
    Filed: April 27, 1989
    Date of Patent: February 26, 1991
    Assignee: Acme Resin Corporation
    Inventors: Calvin K. Johnson, Richard C. Cooke, Kwok-Tuen Tse
  • Patent number: 4682954
    Abstract: 1.
    Type: Grant
    Filed: October 24, 1960
    Date of Patent: July 28, 1987
    Inventor: Richard C. Cook
  • Patent number: 4469517
    Abstract: A process is provided for treating impure silica-containing sands to make them more suitable for foundry use. The sands are treated with aqueous alkali metal silicate solutions and the resulting mixture is heated before the sands are coated with a resin binder. Foundry cores and molds prepared with these treated sands show improved hot and cold tensile strengths.
    Type: Grant
    Filed: January 20, 1983
    Date of Patent: September 4, 1984
    Assignee: Acme Resin Corporation
    Inventor: Richard C. Cooke, Jr.
  • Patent number: 4130599
    Abstract: A silicone molding composition with improved thermal shock resistance having a plasticizing amount of a silicone resin comprising chemically combined RSiO.sub.3/2 units and R.sub.2 SiO units where the R to Si ratio may vary from 1.0 to 1.9 and the ratio of RSiO.sub.3/2 units to R.sub.2 SiO units may vary from 1:2.5 to 1:5.0 and containing less than 0.5 weight percent of silanol groups and preferably being substantially free of silanol groups where R is a monovalent hydrocarbon radical. There is also provided by the present invention a process for improving the thermal shock resistance of a silicone molding composition by having in said composition the aforesaid resin.
    Type: Grant
    Filed: June 16, 1976
    Date of Patent: December 19, 1978
    Assignee: General Electric Company
    Inventors: Duane F. Merrill, Richard C. Cooke, Jr.