Abstract: A process for improving design-limited yield by collecting test fail data, converting to electrical faults, and localizing to physical area on semiconductor die. The steps of identifying an area on a wafer containing a fault to enable the analysis of specific defects, accumulating data suitable for yield monitoring analysis based on pattern test failures logged on scan cells in scan chains on automatic test equipment, and translating scan cell and scan chain failure reports to geometric locations of electrical structures on wafers.

Abstract: A process for conserving storage space and time while recording not only a pass or fail result per die but also additional failure test pattern data by computing and comparing digital fault signatures or hash values on a tester.

Abstract: A method for operating a secure semiconductor IP access server to support failure analysis. A client presents a test failure and failure type to an automated server which traverses an electronic product design, definition, and test database to report specifically those components and interconnect likely to cause the failure with geometrical information which may be displayed on the client. Other aspects of semiconductor IP are protected by the server by limiting the trace mechanism and renaming components.

Abstract: In a method for determining a number of possible hold time faults in a scan chain of a DUT, an environmental variable of the scan chain is set to a value believed to cause a hold time fault in the scan chain, and then a pattern is shifted through the scan chain. The pattern has a background pattern of at least n contiguous bits of a first logic state, followed by at least one bit of a second logic state, where n is a length of the scan chain. The number of possible hold time faults in the scan chain can be determined as a difference between i) a clock cycle when the at least one bit is expected to cause a transition at an output of the scan chain, and ii) a clock cycle when the at least one bit actually causes a transition at the output of the scan chain. If a value of the environmental variable at which the scan chain operates correctly can be determined, the location of one or more hold time faults can also be determined.

Abstract: A method for data logging from inside a semiconductor device, yielding timing performance information about the logic behind each and every flip-flop in the scan chain and displaying the sensitivity of certain flipflops to speed related manufacturing defects. The method comprises steps for testing, measuring, storing, and analyzing records for frequency characterization of complex digital semiconductors.

Abstract: A method for determining that failures in semiconductor test are due to a defect potentially causing a hold time violation in a scan cell in a scan chain, counting the number of potential defects, and, if possible, localizing, and ameliorating hold time defects in a scan chain.

Abstract: A method for operating a secure semiconductor IP access server to support failure analysis. A client presents a test failure and failure type to an automated server which traverses an electronic product design, definition, and test database to report specifically those components and interconnect likely to cause the failure with geometrical information which may be displayed on the client. Other aspects of semiconductor IP are protected by the server by limiting the trace mechanism and renaming components.

Abstract: A process for identifying the location of a break in a scan chain in real time as fail data is collected from a tester. Processing a test pattern before applying it on a tester provides a signature enabling a method for a tester to identify a scan cell which is stuck during the time the tester is operating on a device under test rather than accumulating voluminous test data sets for delayed offline analysis.

Abstract: A method for determining that failures in semiconductor test are due to a defect potentially causing a hold time violation in a scan cell in a scan chain, counting the number of potential defects, and, if possible, localizing, and ameliorating hold time defects in a scan chain.

Abstract: In a method for determining a number of possible hold time faults in a scan chain of a DUT, an environmental variable of the scan chain is set to a value believed to cause a hold time fault in the scan chain, and then a pattern is shifted through the scan chain. The pattern has a background pattern of at least n contiguous bits of a first logic state, followed by at least one bit of a second logic state, where n is a length of the scan chain. The number of possible hold time faults in the scan chain can be determined as a difference between i) a clock cycle when the at least one bit is expected to cause a transition at an output of the scan chain, and ii) a clock cycle when the at least one bit actually causes a transition at the output of the scan chain. If a value of the environmental variable at which the scan chain operates correctly can be determined, the location of one or more hold time faults can also be determined.

Abstract: A process for identifying the location of a break in a scan chain in real time as fail data is collected from a tester. Processing a test pattern before applying it on a tester provides a signature enabling a method for a tester to identify a scan cell which is stuck during the time the tester is operating on a device under test rather than accumulating voluminous test data sets for delayed offline analysis.

Abstract: A method for data logging from inside a semiconductor device, yielding timing performance information about the logic behind each and every flip-flop in the scan chain and displaying the sensitivity of certain flipflops to speed related manufacturing defects. The method comprises steps for testing, measuring, storing, and analyzing records for frequency characterization of complex digital semiconductors.

Abstract: A process for conserving storage space and time while recording not only a pass or fail result per die but also additional failure test pattern data by computing and comparing digital fault signatures or hash values on a tester.

Abstract: A process for improving design-limited yield by collecting test fail data, converting to electrical faults, and localizing to physical area on semiconductor die. The steps of identifying an area on a wafer containing a fault to enable the analysis of specific defects, accumulating data suitable for yield monitoring analysis based on pattern test failures logged on scan cells in scan chains on automatic test equipment, and translating scan cell and scan chain failure reports to geometric locations of electrical structures on wafers.

Abstract: A method and system for automated multisite testing. Specifically, in one embodiment, a method is disclosed for determining a testing order of plurality of testing operations of a test flow in a multisite testing environment. The method begins by automatically walking through the test flow by performing recursion on the plurality of testing operations. Next, the method automatically assigns a plurality of relative priorities to the plurality of testing operations. The plurality of relative priorities determine the testing order used when executing each of the plurality of testing operations in said test flow. Each of the plurality of testing operations is executed only once when testing a plurality of devices under test (DUTs) in the multisite testing environment.