Abstract: A process for manufacturing a metallized substrate using the island coating method, includes depositing a coating layer containing a radiation curable non-volatile film former. The coated part is then vacuum metallized to form the metal islands of the present invention. A layer of clear resinous protective dielectric topcoat containing a radiation curable non-volatile film former is then deposited to completely cover the layer of metal islands while maintaining the aesthetic properties of the metallizing island coating system at a reduced cost and with minimal variability among parts.

Abstract: A process for manufacturing a metallized substrate using the island coating method, includes depositing a coating layer containing a radiation curable non-volatile film former. The coated part is then vacuum metallized to form the metal islands of the present invention. A layer of clear resinous protective dielectric topcoat containing a radiation curable non-volatile film former is then deposited to completely cover the layer of metal islands while maintaining the aesthetic properties of the metallizing island coating system at a reduced cost and with minimal variability among parts.

Abstract: A process for manufacturing a metallized substrate using the island coating method, includes depositing a coating layer containing a radiation curable non-volatile film former. The coated part is then vacuum metallized to form the metal islands of the present invention. A layer of clear resinous protective dielectric topcoat containing a radiation curable non-volatile film former is then deposited to completely cover the layer of metal islands while maintaining the aesthetic properties of the metallizing island coating system at a reduced cost and with minimal variability among parts.

Abstract: A process for manufacturing a metallized part comprises the following steps. A part is provided made from a substrate material selected from the group consisting of thermoplastic urethane (TPU), TPU alloys, polyester alloys, nylon, thermoplastic olefins (TPO) and aluminum. A single protective layer (combined primer/basecoat) is spray deposited, flashed and cured over the substrate. Over the combined primer/basecoat layer, a layer of corrosion prone metal is vacuum deposited to form a discontinuous film covering the combined primer/basecoat layer. A layer of clear resinous protective dielectric topcoat is spray deposited and cured to completely cover the layer of vacuum deposited corrosion prone metal material and fill channels formed in the discontinuous film layer.

Abstract: An aluminum object is manufactured by a process including chromate conversion coating of the aluminum object; sequentially applying a primer coat to the outer surface and thereafter applying a dielectric substrate basecoat; vacuum metallizing a corrosion prone metal, namely indium, on the dielectric substrate basecoat to form "islands" of the indium that are top coated with a clear resinous layer to encapsulate and insulate the islands, one from another. The indium islands are less than one thousand angstroms thick and have an average diameter of less than three thousand angstroms. The island structure is etched following the growth of the metal as it is deposited between the nucleation stage and the stage of channelization of formation of an electrically conductive film. The etchant is selected to clear channels between island structures to improve adhesion of a dielectric resinous top coat to the dielectric substrate by order of magnitude to adhesion to the islands.

Abstract: A high gloss color finish for a plastic article is formed by coating and curing a colored primer layer (12) onto a plastic substrate (10). A light transmissive basecoat (14) is applied and cured onto the primer layer (12) to form a substrate (10) with a colored surface. Indium islands (20) are vacuum deposited onto the basecoat (12) to a thickness up to 100 Angstroms to form a visually macroscopically continuous layer (21). The island layer (21) is etched to remove smaller sized islands. A transparent topcoat (24) is applied onto the basecoat and indium islands and cured in place.

Abstract: An aluminum object is manufactured by a process including chromate conversion coating of the aluminum object; sequentially applying a primer coat to the outer surface and thereafter applying a dielectric substrate basecoat; vacuum metallizing a corrosion prone metal, namely indium, on the dielectric substrate basecoat to form "islands" of the indium that are top coated with a clear resinous layer to encapsulate and insulate the islands, one from another. The indium islands are less than one thousand angstroms thick and have an average diameter of less than three thousand angstroms. The island structure is etched following the growth of the metal as it is deposited between the nucleation stage and the stage of channelization of formation of an electrically conductive film. The etchant is selected to clear channels between island structures to improve adhesion of a dielectric resinous top coat to the dielectric substrate by order of magnitude to adhesion to the islands.

Abstract: Vacuum metallizing substrates having both vertical and horizontal surfaces occurs by directing metal from two remote sources by thermal evaporation. One source is connected horizontally below the object to depose metal vertically toward the object to the horizontal surface thereof. The second source is connected vertically to the object to depose metal horizontally toward the object to the vertical surface thereof. A vacuum chamber contains a rotating carousel supporting the objects with the sources located fixedly within the chamber to perform the thermal evaporation.

Abstract: A plastic object is manufactured by a process including vacuum metallizing with a corrosion prone metal, namely indium, a dielectric substrate to form "islands" of the indium top coated with a clear resinous layer which encapsulates and insulates the islands, one from another. The indium islands are less than one thousand angstroms thick and have an average diameter of less than three thousand angstroms. The island structure is etched following the growth of the metal as it is deposited between the nucleation stage and the stage of channelization of formation of an electrically conductive film. The etchant is selected to clear channels between island structures to improve adhesion of a dielectric resinous top coat to the dielectric substrate by order of magnitude to adhesion to the islands.A preferred application of this invention is the manufacture of exterior automobile trim components the base structure of which is a flexible elastomer such as a thermoplastic urethane.

Abstract: A surprisingly corrosion and abuse resistant plastic object vacuum-metallized with a corrosion prone metal, namely indium, on a dielectric substrate consists of minute specular electrically-discrete "islands" of the indium topcoated with a clear resinous layer which encapsulates and insulates the islands, one from another. The indium islands are less than one thousand angstroms thick and have an average diameter of less than three thousand angstroms. This island structure is secured by stopping the growth of the metal as it is deposited between the nucleation stage and the stage of channelization or formation of an electrically conductive film. The island structure permits the dielectric resinous topcoat to penetrate in, about and under the metal islands encapsulating and securely bonding them to the substrate.The vacuum deposited indium gives a bright sheeny appearance which, when properly topcoated, very closely duplicates the appearance of electrodeposited chrome.

Abstract: A surprisingly corrosion and abuse resistant plastic object vacuum-metallized with a corrosion prone metal, on a dielectric substrate consists of minute specular electrically-discrete "islands" of the metal topcoated with a clear resinous layer which encapsulates and insulates the islands, one from another. The metal islands are less than one thousand angstroms thick and have an average diameter of less than three thousand angstroms. This island structure is secured by stopping the growth of the metal as it is deposited between the nucleation stage and the stage of channelization or formation of an electrically conductive film. The island structure permits the dielectric resinous topcoat to penetrate in, about and under the metal islands encapsulating and securely bonding them to the substrate.