Patents by Inventor Richard C. Heim

Richard C. Heim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4852516
    Abstract: A self-contained modular processing apparatus is disclosed for processing workpieces, and in particular, silicon wafers. The apparatus is constructed of framed modules which plug into a service facility docking subassembly and interlock therewith to make up a complete modular processing system for wafer processing. Each module may be provided with its own wafer transporting mechanism and includes a built-in CPU such that each module is an independent, stand-alone processing unit. Each processing unit, by being capable of independent operation, functions as a building block to configure a modular processing system capable of handling wafer flow in multiple directions while performing a multitude of processing functions or operations. Individual modules are arranged along a line of single fold symmetry such that a single transport mechanism may be employed for transferring wafers among adjacent modules.
    Type: Grant
    Filed: September 1, 1987
    Date of Patent: August 1, 1989
    Assignee: Machine Technology, Inc.
    Inventors: Richard H. Rubin, Benjamin J. Petrone, Richard C. Heim, Scott M. Pawenski
  • Patent number: 4722298
    Abstract: A self-contained modular processing apparatus is disclosed for processing workpieces, and in particular, silicon wafers. The apparatus is constructed of framed modules which plug into a service facility docking subassembly and interlock therewith to make up a complete modular processing system for wafer processing. Each module may be provided with its own wafer transporting mechanism and includes a built-in CPU such that each module is an independent, stand-alone processing unit. Each processing unit, by being capable of independent operation, functions as a building block to configure a modular processing system capable of handling wafer flow in multiple directions while performing a multitude of processing functions or operations. Individual modules are arranged along a line of single fold symmetry such that a single transport mechanism may be employed for transferring wafers among adjacent modules.
    Type: Grant
    Filed: May 19, 1986
    Date of Patent: February 2, 1988
    Assignee: Machine Technology, Inc.
    Inventors: Richard H. Rubin, Benjamin J. Petrone, Richard C. Heim, Scott M. Pawenski
  • Patent number: 4100926
    Abstract: An elongated workpiece is passed through the axis of a cylindrical ultrasonic transducer in a conduit containing solvent agent for ultrasonic cleaning. The cleaning action is performed with liquid solvent in a blanket of saturated vapor maintained by a solvent boiling sump, while the transducer is kept isolated from the vapor by a special compartment communicating only with the atmosphere for air cooling. Vestibules allow an overflow of solvent from the conduit in entry and exit chambers traversed by the workpiece and circulation of condensate is maintained to and from a storage sump of liquid solvent.
    Type: Grant
    Filed: September 22, 1976
    Date of Patent: July 18, 1978
    Assignee: Westinghouse Electric Corp.
    Inventor: Richard C. Heim
  • Patent number: 4069444
    Abstract: An ultrasonic power generator for operation at a one and a half kilowatt power output from a 220 volt, 50 hertz AC line comprising a transducer coil impedance associated with a resonant capacitor, said generator being generally designed for a one kilowatt power output from a 110 volt, 60 hertz AC line. The generator circuit includes at least one thyristor for switching the resonant capacitor terminals and an oscillating circuit having a time basis including said capacitor designed for circulating a high frequency current at the desired ultrasonic operating frequency sufficient to generate one and a half ohmic kilowatts. A small high Q inductance is added to the inductive reactance of said transducer coil for adjustment to the capacitance values of the oscillating circuit.
    Type: Grant
    Filed: June 1, 1976
    Date of Patent: January 17, 1978
    Assignee: Westinghouse Electric Corporation
    Inventor: Richard C. Heim