Abstract: An analog-to-digital converter (ADC) arrangement mounts at least one ADC integrated circuit on a six-layer printed circuit board including an analog ground plane in a second layer occupying a region distinct from a digital ground plane in a fifth layer. Analog signals are carried over paths of a first layer overlying the second layer ground plane. The analog signal paths may be configured as microstrip transmission lines. Digital signals produced by the IC are coupled onto digital signal paths overlying the digital ground plane. Third and fourth layers of the six-layer printed circuit board carry power to signal conditioning circuits. Conditioned power is coupled to the ADC integrated circuit and any other IC's.