Patents by Inventor Richard C. Kershner

Richard C. Kershner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bonding electronic components
    Patent number: 4396140
    Abstract: Disclosed is a method of bonding electronic components (14) to metallized substrates (21) by soldering. The solder is first deposited on an unmetallized substrate (10) in a pattern of discrete pads (11, 12, 13) corresponding to the leads (28, 29, 30) of the components to be bonded. The component leads are then placed on the pads and the solder is reflowed. The solder thereby adheres to the leads so that a controlled amount of solder will remain on each lead when the component is lifted from the substrate. The components can then be soldered to an appropriate metallized substrate.
    Type: Grant
    Filed: January 27, 1981
    Date of Patent: August 2, 1983
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Donald Jaffe, Richard C. Kershner, Nicholas T. Panousis