Abstract: A microelectronic packaging and interconnection apparatus and method in which dual ball bonds, metal bumps, or TAB bonds are formed by pulsed laser irradiation, but not conventional heating, compression or acoustic (e.g., ultrasonic) methods. A miniature loop forming tool is used to form a metallic wire loop, one end of which is welded to an IC bond pad while the other end of which is welded to an IC package bonding finger, thus forming ball bonds at both ends of the interconnection.

Abstract: A three color laser system employs a diode pumped Nd:YAG or Nd:YLF laser to provide a green output beam and to pump two Ti:S lasers. One Ti:S laser emits a tunable red beam, while the second emits a near infrared beam. The near infrared beam is frequency doubled by a NLO device to provide a tunable blue output beam. The beams may be directed to separate optical fibers or to a single fiber. A reversed Cassegrainian mirror arrangement is used to combine a plurality of beams for transmission in a single optical fiber.

Abstract: An air cooled, flash lamp pumped, solid state laser device wherein heating devices are disposed on the laser rod at both ends to heat and temperature stabilize the laser rod. The solid state, laser rod is longer than the arc length of the flash lamp. The ends of the laser rod can be heated directly by winding heating wire, such as Nichrome, around each end or by applying heat through thermal conductive supports. A feedback loop is provided to maintain temperature of the solid state laser rod, which is preferably Alexandrite, within a desired range of 80.degree. C. to 120.degree. C.