Patents by Inventor Richard C. Schaefer

Richard C. Schaefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7709744
    Abstract: Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: May 4, 2010
    Assignee: Intel Corporation
    Inventors: Richard C. Schaefer, Steven Pollock, Charles M. Bailley, Mike Lowe, Andrew J. Balk, John G. Oldendorf
  • Publication number: 20080236871
    Abstract: Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 2, 2008
    Applicant: INTEL CORPORATION
    Inventors: Richard C. Schaefer, Steven Pollock, Charles M. Bailley, Mike Lowe, Andrew J. Balk, John G. Oldendorf