Abstract: A predetermined electrical circuit pattern or discrete features composed of discrete, electrically conducting metal pathways and non-conducting spaces therebetween is formed on a dielectric substrate by(1) depositing a continuous layer of an electrically conducting metal on a surface of the substrate,(2) contacting the metal layer with a mask head defining a system of ridges and valleys therein, the ridges corresponding to the pathways of the target electrical circuitry pattern or discrete features and the valleys corresponding to the spaces of the target pattern, the ridges in the mask head contacting the metal layer in sealing arrangement with the portions of the metal layer coming into contact with the ridges, and(3) contacting the metal layer with an etchant to remove the portions of the metal layer in the spaces and thereby form the target electrical circuitry or discrete features pattern.

Abstract: A lapping machine control system which utilizes a electromechanical probe to generate a signal responsive to the separation of the laps, which also represents the thickness of the part being lapped. The separation signal, which is unsuitable for direct control since it is too noisy, is used with a best fit algorithm to estimate the time to reduce the part to the desired thickness, based on the rate of material removal provided by extrapolated line representing the best fit of the lap separation signal. The machining is terminated when the extrapolated line reaches the intercept of time and thickness.