Patents by Inventor Richard Charles Davis

Richard Charles Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid coverlays for flexible printed circuit boards
    Patent number: 9670306
    Abstract: The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: June 6, 2017
    Assignee: Sun Chemical Corporation
    Inventors: Stephen Anthony Hall, Richard Charles Davis, Simon Richard Ford, Matthias Klaus, Karl-Heinz Ognibeni
  • Polyamideimide adhesives for printed circuit boards
    Patent number: 9668360
    Abstract: The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: May 30, 2017
    Assignee: Sun Chemical Corporation
    Inventors: Richard Charles Davis, Simon Richard Ford, Stephen Anthony Hall, Matthias Klaus, Karl-Heinz Ognibeni
  • POLYAMIDEIMIDE ADHESIVES FOR PRINTED CIRCUIT BOARDS
    Publication number: 20120222889
    Abstract: The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
    Type: Application
    Filed: October 28, 2010
    Publication date: September 6, 2012
    Applicant: SUN CHEMICAL B.V.
    Inventors: Richard Charles Davis, Simon Richard Ford, Stephen Anthony Hall, Matthias Khaus, Karl-Heinz Ognibeni
  • LIQUID COVERLAYS FOR FLEXIBLE PRINTED CIRCUIT BOARDS
    Publication number: 20120000696
    Abstract: The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
    Type: Application
    Filed: March 16, 2010
    Publication date: January 5, 2012
    Applicant: SUN CHEMICAL B.V.
    Inventors: Stephen Anthony Hall, Richard Charles Davis, Simon Richard Ford, Matthias Klaus, Karl-Heinz Ognibeni