Abstract: A microelectromechanical system (MEMS) analog isolator may be created in which an actuator such as an electrostatic motor drives a beam against an opposing force set, for example, by another electrostatic motor. Motion of the beam may be sensed by a sensor also attached to the beam. The beam itself is electrically isolated between the locations of the actuator and the sensor. The structure may be incorporated into integrated circuits to provide on-chip isolation.

Abstract: A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower surface of the wafer that is bonded to the substrate. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material. Furthermore, a bridge, which is preferably insulating, is pre-etched before the wafer is attached to the substrate.

Abstract: A MEMS structure is provided having a cap that encapsulates and protects the fragile components of the device, while having an electrical trace embedded in a nonconductive substrate. The electrical trace includes a first terminal end that is exposed to the peripheral region of the device, and a second end that is connected to the MEMS structure to facilitate operation of the device.

Abstract: A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.

Abstract: A method for fabricating an electrically isolated MEMS device is provided that uses surface fabrication techniques to form a conductive stationary MEMS element, and a movable MEMS element spaced apart from the conductive stationary MEMS element. The movable element includes a nonconductive base which provides for electrical isolation between a plurality of conductive members extending from the base. Modifications to the basic process permit the incorporation of a wafer-level cap which provides mechanical protection to the movable portions of the device.

Abstract: An on-board micro-electromechanical (MEMS) isolator is provided on board a power semiconductor device for measuring voltage, current, or both. In particular, the power semiconductor may comprise a plurality of transistors connected in parallel, such that a MEMS isolator connected in parallel with one of the transistors measures voltage across the semiconductor. A MEMS isolator may further be connected in series with the transistors to measure current flow thereacross. A compensation circuitry may be provided to receive the current output from the isolator, and determine total current flow through the power semiconductor.

Abstract: A microelectromechanical systems (MEMS) Device manufactured on a microscopic scale using integrated circuit techniques provides a sensitive magnetic field sensor by detecting motion caused by the Lorentz force produced by a current through a MEMS conductor. The resulting MEMS may be used as a component in a variety of devices including current sensors and proximity sensors.

Abstract: Microelectricalmechanical systems (MEMS) manufactured on a microscopic scale using integrated circuit techniques may be used to measure a variety of parameters using electrical signals generated by the movement of small beams. Inertial noise may be canceled by the duplication of the beam structure for sensing of the acceleration to be subtracted from a similar beam structure used to measure the parameter of interest.

Abstract: An isolated-ADC and a method for providing isolated analog-to-digital conversion are disclosed. The isolated-ADC includes a microelectromechanical system (MEMS), a comparator, and a digital-to-analog converter (DAC). The MEMS includes a beam element supported from a substrate for movement with respect to an axis, first and second actuators and a sensor. The first and second actuators are capable of exerting respective forces upon the beam element causing the beam element to move in response to analog input and feedback signals, respectively. The sensor detects changes in position of the beam element and produces a position signal indicative thereof. The comparator generates a digital signal based upon a comparison of the position signal with a reference value. Based on the digital signal, the DAC generates the feedback signal, and the isolated-ADC produces a digital output signal.

Abstract: A microelectricalmechanical system (MEMS) digital isolator may be created in which an actuator such as an electrostatic motor drives a beam against a predefined force set, for example, by another electrostatic motor. When the threshold of the opposing force is overcome, motion of the beam may be sensed by a sensor also attached to the beam. The beam itself is electrically isolated between the locations of the actuator and the sensor. The structure may be incorporated into integrated circuits to provide on-chip isolation.

Abstract: A method is presented for fabricating an electrically isolated MEMS device having a conductive outer MEMS element, and an inner movable MEMS element spaced apart from the conductive outer MEMS element. The inner element includes a nonconductive base having a plurality of conductive structures extending therefrom. The conductive components are formed by plating a conductive material into a pre-formed mold which defines the shape of the conductor.

Abstract: A method is presented for fabricating an electrically isolated MEMS device having a conductive outer MEMS element, and an inner movable MEMS element spaced apart from the conductive outer MEMS element. The inner element includes a nonconductive base having a plurality of conductive structures extending therefrom. The conductive components are formed by plating a conductive material into a pre-formed mold which defines the shape of the conductor.

Abstract: An on-board micro-electromechanical (MEMS) isolator is provided on board a power semiconductor device for measuring voltage, current, or both. In particular, the power semiconductor may comprise a plurality of transistors connected in parallel, such that a MEMS isolator connected in parallel with one of the transistors measures voltage across the semiconductor. A MEMS isolator may further be connected in series with the transistors to measure current flow thereacross. A compensation circuitry may be provided to receive the current output from the isolator, and determine total current flow through the power semiconductor.

Abstract: An isolated-ADC and a method for providing isolated analog-to-digital conversion are disclosed. The isolated-ADC includes a microelectromechanical system (MEMS), a comparator, and a digital-to-analog converter (DAC). The MEMS includes a beam element supported from a substrate for movement with respect to an axis, first and second actuators and a sensor. The first and second actuators are capable of exerting respective forces upon the beam element causing the beam element to move in response to analog input and feedback signals, respectively. The sensor detects changes in position of the beam element and produces a position signal indicative thereof. The comparator generates a digital signal based upon a comparison of the position signal with a reference value. Based on the digital signal, the DAC generates the feedback signal, and the isolated-ADC produces a digital output signal.

Abstract: A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower surface of the wafer that is bonded to the substrate. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material. Furthermore, a bridge, which is preferably insulating, is pre-etched before the wafer is attached to the substrate.

Abstract: A method for fabricating an electrically isolated MEMS device is provided that uses surface fabrication techniques to form a conductive stationary MEMS element, and a movable MEMS element spaced apart from the conductive stationary MEMS element. The movable element includes a nonconductive base which provides for electrical isolation between a plurality of conductive members extending from the base. Modifications to the basic process permit the incorporation of a wafer-level cap which provides mechanical protection to the movable portions of the device.

Abstract: An apparatus for transferring an article onto a pallet is situated between conveyor sections. The apparatus includes a pusher mechanism arranged to push the article from a location at or adjacent to the first conveyor section toward a pallet disposed on the second conveyor section. An extension fork assembly is provided between the pusher mechanism and the pallet. The extension fork assembly defines a stationary transfer surface over which the article travels on its path toward the pallet. The assembly also includes a plurality of extension forks that are extended over the pallet. The article is pushed onto the extension forks until the article is situate over the pallet. The extension forks are then retracted while the article is held in position over the pallet by the pusher mechanism. When the forks are completely retracted the article is safely sitting directly on the pallet.

Abstract: A microelectromechanical systems (MEMS) Device manufactured on a microscopic scale using integrated circuit techniques provides a sensitive magnetic field sensor by detecting motion caused by the Lorentz force produced by a current through a MEMS conductor. The resulting MEMS may be used as a component in a variety of devices including current sensors and proximity sensors.

Abstract: A MEMS structure is provided having a cap that encapsulates and protects the fragile components of the device, while having an electrical trace embedded in a nonconductive substrate. The electrical trace includes a first terminal end that is exposed to the peripheral region of the device, and a second end that is connected to the MEMS structure to facilitate operation of the device.

Abstract: A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.