Patents by Inventor Richard D. Kosoglow
Richard D. Kosoglow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11963288Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).Type: GrantFiled: June 17, 2022Date of Patent: April 16, 2024Assignee: Apple Inc.Inventors: Trevor J. Edmonds, Jay S. Nigen, Richard D. Kosoglow, Ron A. Hopkinson
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Publication number: 20230413416Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).Type: ApplicationFiled: June 17, 2022Publication date: December 21, 2023Inventors: Trevor J. EDMONDS, Jay S. NIGEN, Richard D. KOSOGLOW, Ron A. HOPKINSON
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Publication number: 20230395984Abstract: An electronic device may have an upper housing and a lower housing separated by a slot. An antenna module may be mounted in the lower housing and may include a cavity. An antenna element may be disposed within the cavity. Grounded traces may be patterned onto walls of the module and may be coupled to conductive walls of the lower housing by conductive gaskets. The antenna element may have a high band arm displaced farther into the cavity than a low band arm by a shim. The antenna module may have an acoustic port aligned with a speaker port. The acoustic port may allow sound waves from a speaker to pass into the cavity from the speaker port. The cavity may be configured to optimize an audio response of the speaker while concurrently optimizing radio-frequency performance of the antenna element.Type: ApplicationFiled: June 3, 2022Publication date: December 7, 2023Inventors: Joel D. Barrera, Nikolaos Chiotellis, Michael J. Williams, Jerzy S. Guterman, Trevor J. Edmonds, Joshua P. Song, Richard D. Kosoglow
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Publication number: 20230251694Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: ApplicationFiled: April 7, 2023Publication date: August 10, 2023Applicant: APPLE INC.Inventors: Brett W. DEGNER, Caitlin Elizabeth KALINOWSKI, Richard D. KOSOGLOW, Joshua D. BANKO, David H. NARAJOWSKI, Jonathan L. BERK, Michael E. LECLERC, Michael D. MCBROOM, Asif IQBAL, Paul S. MICHELSEN, Mark K. SIN, Paul A. BAKER, Harold L. SONTAG, Wai Ching YUEN, Matthew P. CASEBOLT, Kevin S. FETTERMAN, Alexander C. CALKINS, Daniel L. MCBROOM
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Publication number: 20230247349Abstract: In at least one example, an electronic device can include a lower base portion including a housing. The housing can define an internal volume of the lower portion and a rear side defining an aperture. The device can also include an upper portion rotatably connected to the lower portion at the rear side, an audio component disposed in the internal volume, and a channel extending from the audio component to the aperture.Type: ApplicationFiled: August 4, 2022Publication date: August 3, 2023Inventors: Houtan R. Farahani, Richard D. Kosoglow, Trevor J. Edmonds, Vanessa M. Wijaya, Keith J. Hendren, Zachary Sorscher, Ron A. Hopkinson, Chi Xu, Ari P. Miller, Rodrigo Dutervil Mubarak
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Patent number: 11650634Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: February 1, 2022Date of Patent: May 16, 2023Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Publication number: 20220155830Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: ApplicationFiled: February 1, 2022Publication date: May 19, 2022Inventors: Brett W. DEGNER, Caitlin Elizabeth KALINOWSKI, Richard D. KOSOGLOW, Joshua D. BANKO, David H. NARAJOWSKI, Jonathan L. BERK, Michael E. LECLERC, Michael D. MCBROOM, Asif IQBAL, Paul S. MICHELSEN, Mark K. SIN, Paul A. BAKER, Harold L. SONTAG, Wai Ching YUEN, Matthew P. CASEBOLT, Kevin S. FETTERMAN, Alexander C. CALKINS, Daniel L. MCBROOM
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Patent number: 11256307Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: July 28, 2020Date of Patent: February 22, 2022Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. Mcbroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Patent number: 11071228Abstract: A rack system for one or more computing systems is described. The rack system may include support structures, or rack structures, and a housing affixed or un-affixed to the support structures. The rack system may include rails, including telescoping rails, affixed to the support structures and coupled to the computing system. When the rack system is in a closed position, the computing system is positioned within the housing. When the rack system is in an open position, the computing system is removed from the housing and the components of the computing system are accessible. In the open position, only components on one surface of the circuit board are accessible. However, the computing system can rotate, thereby placing the components on the opposing surface of the circuit board in an accessible position. Alternatively, the housing can be affixed to the computing system, and include modifications for access to the computing system.Type: GrantFiled: September 25, 2019Date of Patent: July 20, 2021Assignee: Apple Inc.Inventors: Daniel D. Hershey, Christoph M. Pistor, Bartley K. Andre, Richard D. Kosoglow, Michael D. McBroom, Shravan Bharadwaj, Jonathan L. Berk, Houtan R. Farahani, James M. Cuseo, William R. Allan, II, David C. Parell, Eric A. Knopf, Seth G. McFarland
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Publication number: 20200379526Abstract: An electronic device can include a frame configured to receive and support an electronic component, a shell defining an internal volume sized to encompass the frame and the electronic component, the shell being slidably removable from the frame, the electronic component positioned within the internal volume and including an aperture, and a sealing member including a seal body and a compressible lip extending from the seal body, the sealing member at least partially surrounding the electronic component. The compressible lip is oriented such that the shell compresses the lip in a direction against the seal body at a first position adjacent to the electronic component and in the direction against the seal body at a second position adjacent to the electronic component opposite the first position.Type: ApplicationFiled: September 27, 2019Publication date: December 3, 2020Inventors: Bart K. Andre, Edward J. Cooper, Brett W. Degner, Houtan R. Farahani, Steven A. Gerasimoff, William H. Greenbaum, James T. Handy, Daniel D. Hershey, PengYuan Huang, Eric A. Knopf, Richard D. Kosoglow, Mariel L. Lanas, Michael E. Leclerc, Michael D. McBroom, Rodrigo Dutervil Mubarak, David C. Parell, Sabrina K. Paseman, Eric R. Prather, Jacob W. Rutheiser, Christopher G. Siegel, Cheng-Han Yang, James M. Cuseo, Francesco Ferretti
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Patent number: 10845852Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: October 16, 2019Date of Patent: November 24, 2020Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Publication number: 20200356148Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: ApplicationFiled: July 28, 2020Publication date: November 12, 2020Inventors: Brett W. DEGNER, Caitlin Elizabeth KALINOWSKI, Richard D. KOSOGLOW, Joshua D. BANKO, David H. NARAJOWSKI, Jonathan L. BERK, Michael E. LECLERC, Michael D. MCBROOM, Asif IQBAL, Paul S. MICHELSEN, Mark K. SIN, Paul A. BAKER, Harold L. SONTAG, Wai Ching YUEN, Matthew P. CASEBOLT, Kevin S. FETTERMAN, Alexander C. CALKINS, Daniel L. MCBROOM
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Patent number: 10725507Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: April 6, 2019Date of Patent: July 28, 2020Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Patent number: 10674803Abstract: A wearable band may include a first strap portion including a loop, and a second strap portion positionable through the loop of the first strap portion. The second strap portion may include a multi-pole magnet assembly, the multi-pole magnet assembly including two or more magnets arranged in a multi-pole magnet structure and at least one discrete shunt positioned over a surface of the multi-pole magnet structure.Type: GrantFiled: October 19, 2018Date of Patent: June 9, 2020Assignee: Apple Inc.Inventors: Richard D. Kosoglow, Hao Zhu, James A. Stryker
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Patent number: 10642327Abstract: An electronic device may be provided with a housing surrounding an interior portion of the electronic device. The housing may have one or more layers of material such as fabric layers, polymer layers, and metal layers. An outer fabric layer may have openings between adjacent strands of material such as openings between adjacent warp and weft strands. An inner housing layer such as a layer of plastic or metal may have openings that define airflow entrance and exit ports. The outer fabric layer may overlap the openings of the airflow entrance and exit ports. A fan may draw cooling air into the interior through the airflow entrance port and may expel air through the airflow exit port. An airflow controller in the interior may be controlled by control circuitry based on measurements from temperature sensors. The airflow controller may steer airflow to cool appropriate electronic components in the interior.Type: GrantFiled: July 30, 2018Date of Patent: May 5, 2020Assignee: Apple Inc.Inventors: Mikael M. Silvanto, Richard D. Kosoglow, David H. Narajowski, Bart K. Andre, Brett W. Degner, Daniele G. De Iuliis, Houtan R. Farahani, Eric R. Prather
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Publication number: 20200100383Abstract: A rack system for one or more computing systems is described. The rack system may include support structures, or rack structures, and a housing affixed or un-affixed to the support structures. The rack system may include rails, including telescoping rails, affixed to the support structures and coupled to the computing system. When the rack system is in a closed position, the computing system is positioned within the housing. When the rack system is in an open position, the computing system is removed from the housing and the components of the computing system are accessible. In the open position, only components on one surface of the circuit board are accessible. However, the computing system can rotate, thereby placing the components on the opposing surface of the circuit board in an accessible position. Alternatively, the housing can be affixed to the computing system, and include modifications for access to the computing system.Type: ApplicationFiled: September 25, 2019Publication date: March 26, 2020Inventors: Daniel D. HERSHEY, Christoph M. PISTOR, Bartley K. ANDRE, Richard D. KOSOGLOW, Michael D. MCBROOM, Shravan BHARADWAJ, Jonathan L. BERK, Houtan R. FARAHANI, James M. CUSEO, William R. ALLAN, II, David C. PARELL, Eric A. KNOPF, Seth G. MCFARLAND
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Patent number: 10571973Abstract: An electronic device can include a first and second portions that are pivotally coupled to each other so that the electronic device can have at least a closed configuration and an open configuration. A magnetic sensor system can be carried by the electronic device to detect the closed configuration so that the electronic device can automatically turn to a mode, such as a sleep mode, when the electronic device is bought to the closed configuration. A magnetic sensor can have a detection axis that targets a horizontal component of a magnetic field. A triggering magnetic element can be laterally offset relative to the magnetic sensor. The magnetic sensor can also be a magneto-resistive sensor. The electronic device can also include a second set of magnetic sensor system to confirm when the electronic device is brought to the closed configuration.Type: GrantFiled: April 28, 2017Date of Patent: February 25, 2020Assignee: APPLE INC.Inventors: Chi Xu, Houtan R. Farahani, Richard D. Kosoglow, John C. DiFonzo
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Publication number: 20200042050Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: ApplicationFiled: October 16, 2019Publication date: February 6, 2020Inventors: Brett W. DEGNER, Caitlin Elizabeth KALINOWSKI, Richard D. KOSOGLOW, Joshua D. BANKO, David H. NARAJOWSKI, Jonathan L. BERK, Michael E. LECLERC, Michael D. MCBROOM, Asif IQBAL, Paul S. MICHELSEN, Mark K. SIN, Paul A. BAKER, Harold L. SONTAG, Wai Ching YUEN, Matthew P. CASEBOLT, Kevin S. FETTERMAN, Alexander C. CALKINS, Daniel L. MCBROOM
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Publication number: 20190235587Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: ApplicationFiled: April 6, 2019Publication date: August 1, 2019Inventors: Brett W. DEGNER, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Patent number: 10254805Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: April 27, 2018Date of Patent: April 9, 2019Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom