Patents by Inventor Richard D. Patrick

Richard D. Patrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
    Patent number: 5403465
    Abstract: This invention is directed to an electrodeposited copper foil having a matte-side raw foil R.sub.tm of about 4 to about 10 microns, an ultimate tensile strength measured at 23.degree. C. in the range of about 55,000 to about 80,000 psi, an elongation measured at 23.degree. C. of about 6% to about 25%, an ultimate tensile strength measured at 180.degree. C. in the range of about 30,000 psi to about 40,000 psi, an elongation measured at 180.degree. C. of about 4% to about 15%, and a thermal stability of less than about -20%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) preparing an electrolyte solution comprising copper ions, sulfate ions, chloride ions at a concentration of about 1.2 to about 4.5 ppm, at least one organic additive at a concentration of about 0.4 to about 20 ppm, and at least one impurity at a concentration of about 0.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: April 4, 1995
    Assignee: Gould Inc.
    Inventors: R. Duane Apperson, Sidney J. Clouser, Richard D. Patrick