Abstract: Methods and apparatus for detecting imperfections in adhesive coatings formed on fingers of beams are disclosed. The present invention relates, in one aspect, to a method for preparing a first work piece for joining with a second work piece. The method involves forming a finger in the first work piece, then applying an adhesive coating on the finger. A determination is made to determine whether the adhesive coating is defective through the used of a sensing mechanism which is arranged to scan across a portion of the finger. In one embodiment, a defect in the adhesive coating on the finger is defined as a void.

Abstract: A dispensing head for applying adhesive to a contoured surface of one object which is to be bonded to a complimentary surface of another object is disclosed herein. This dispensing head includes two sections, one of which is provided for receiving adhesive from a supply thereof. The other section is provided for applying this adhesive to the contoured surface to be bonded and includes a complementary adhesive applying surface and a network of channels extending between the adhesive receiving section and the adhesive applying surface. While each of these channels is closed along its length during operation of the dispensing head, the section of the dispensing head defining these channels is divided into two disengagably connected subsections for providing ready access into and along the length of each channel.

Abstract: System and application head for depositing adhesives on surfaces to be bonded. The system includes a supply of adhesive and a pump for urging the adhesive through an outlet line leading from the adhesive supply. A regulator is situated in the adhesive outlet line to provide a substantially constant pressure in the adhesive flow to the downstream system components. An adhesive valve controls delivery of the adhesive to the application head. Means are provided for sensing when the surface to be bonded is in position adjacent to the application head to actuate a timer for controlling the valve whereby adhesive flows to the head for a predetermined period of time. Reverse pressure is then imposed to withdraw adhesive from the application head. The adhesive is deposited on the surface to be bonded during the time when the application head and the surface to be bonded are in cooperation. The head includes internal passages for directing adhesive therethrough to be applied to the surfaces to be bonded.