Patents by Inventor Richard D. Small

Richard D. Small has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6778744
    Abstract: An optical cable (10) includes one or more tubes (120), each containing a number of optical fibers (101), and a plastic jacket (160) that encloses the tube(s). A pair of diametrically opposed rods (300-1, 300-2) are at least partially embedded in the polyethylene jacket and are made from continuous-filament glass fibers that are embedded in epoxy. Each rod has a compressive stiffness that is effective to inhibit substantial contraction of the cable, and a tensile stiffness that is effective to receive tensile loads without substantial transfer of such loads to the glass fibers. Each dielectric rod includes a thin layer (330) of a frictional adhesion coating that provides a controlled adhesion between the rod and the jacket of between 50 and 300 lb./in2. Whereas dual-rod cable designs have a preferred bending plane that passes through the rods, controlled adhesion between the rods and the jacket enables the cable to be easily bent in other planes and to be blown through ducts having multiple corners.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: August 17, 2004
    Assignee: Fitel USA Corp.
    Inventors: Richard Hartford Norris, Richard D. Small, Phillip Maurice Thomas, Peter A. Weimann
  • Patent number: 6611646
    Abstract: A hybrid strength member (300) for an optical cable (10) is made from dielectric materials, and provides excellent compressive and tensile properties within a single structure. The strength member includes two concentric layers of filamentary strands that are embedded in a thermoset material such as epoxy. The filamentary strands of the inner layer (310) primarily comprise aramid fibers, while the filamentary strands of the outer layer (320) primarily comprise glass fibers. A pair of strength members (300-1, 300-2) is embedded in a plastic jacket of the optical cable at diametrically opposite sides of a central core tube that contains a number of optical fibers. Each strength member includes a thin coating (330) of a relatively soft material (i.e., a hardness of less than 80D on the Shore durometer scale) to enhance its coupling to the plastic jacket.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: August 26, 2003
    Assignee: Fitel USA Corp.
    Inventors: Richard Hartford Norris, Richard D. Small, Phillip Maurice Thomas, Peter A. Weimann
  • Patent number: 6594427
    Abstract: A jacket for an outside plant communication cable is made from a resin of an impact-modified polypropylene copolymer compounded with UV stabilizers. The resin has the characteristics of low cost, low post-extrusion shrinkage, high melting temperature and increased crush and abrasion resistance. The UV light stabilizers may include UV absorbers, quenchers, and/or hindered amine light stabilizers.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: July 15, 2003
    Assignee: Fitel USA Corp.
    Inventors: Lisa A. Dixon, Richard H. Norris, Richard D. Small, Phillip M. Thomas, Peter A. Weimann
  • Publication number: 20030044139
    Abstract: An optical cable (10) includes one or more tubes (120), each containing a number of optical fibers (101), and a plastic jacket (160) that encloses the tube(s). A pair of diametrically opposed rods (300-1, 300-2) are at least partially embedded in the polyethylene jacket and are made from continuous-filament glass fibers that are embedded in epoxy. Each rod has a compressive stiffness that is effective to inhibit substantial contraction of the cable, and a tensile stiffness that is effective to receive tensile loads without substantial transfer of such loads to the glass fibers. Each dielectric rod includes a thin layer (330) of a frictional adhesion coating that provides a controlled adhesion between the rod and the jacket of between 50 and 300 lb./in2. Whereas dual-rod cable designs have a preferred bending plane that passes through the rods, controlled adhesion between the rods and the jacket enables the cable to be easily bent in other planes and to be blown through ducts having multiple corners.
    Type: Application
    Filed: September 25, 2002
    Publication date: March 6, 2003
    Inventors: Richard Hartford Norris, Richard D. Small, Phillip Maurice Thomas, Peter A. Weimann
  • Patent number: 6487345
    Abstract: A jacket for a communication cable is made from a resin that has high aspect ratio filler materials, and possibly coupling agents, dispersed therein. The fillers and the coupling agents reduce the post-extrusion shrinkage of the jacketing compound such that the strength members used in the communication cable need have only negligible compressive stiffness. The communication cable may further include a skin coating surrounding the outer jacket.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: November 26, 2002
    Assignee: Fitel USA Corp.
    Inventors: Lisa A. Dixon, Richard D. Small, Phillip M. Thomas, Peter A. Weimann
  • Publication number: 20020118933
    Abstract: A communications cable is disclosed herein that includes an outer jacket, and either a core tube or at least one buffer tube. The core tube or at least one buffer tube includes a resin and high aspect ratio fillers that occupy a predetermined volume of the core tube or buffer tubes so as to impart crush resistance to the cable. Further, the core tube or buffer tube may include two layers, an outer layer and an inner layer, in which the outer layer includes both a resin and high aspect ratio fillers, and the inner layer includes the resin without the high aspect ratio fillers.
    Type: Application
    Filed: February 23, 2001
    Publication date: August 29, 2002
    Inventors: Lisa A. Dixon, Richard H. Norris, Richard D. Small, Peter A. Weimann
  • Patent number: 6430344
    Abstract: A communications cable is disclosed herein that includes an outer jacket, and either a core tube or at least one buffer tube. The core tube or at least one buffer tube includes a resin and high aspect ratio fillers that occupy a predetermined volume of the core tube or buffer tubes so as to impart crush resistance to the cable. Further, the core tube or buffer tube may include two layers, an outer layer and an inner layer, in which the outer layer includes both a resin and high aspect ratio fillers, and the inner layer includes the resin without the high aspect ratio fillers.
    Type: Grant
    Filed: February 23, 2001
    Date of Patent: August 6, 2002
    Assignee: Fitel USA Corp.
    Inventors: Lisa A. Dixon, Richard H. Norris, Richard D. Small, Peter A. Weimann
  • Patent number: 6324324
    Abstract: A jacket for a communication cable is made from a resin that has high aspect ratio filler materials, and possibly coupling agents, dispersed therein. The fillers and the coupling agents reduce the post-extrusion shrinkage of the jacketing compound such that the strength members used in the communication cable need have only negligible compressive stiffness.
    Type: Grant
    Filed: January 12, 2000
    Date of Patent: November 27, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Lisa A. Dixon, Richard D. Small, Phillip M. Thomas, Peter A. Weimann
  • Patent number: 6217809
    Abstract: A method for splicing an improved strength tape having longitudinally extended strands comprises the trimming or patterning of the strands of the respective ends that are to be joined so that the ends can be mated together in a meshing arrangement. The two ends are placed in a splicing tray. An adhesive film is interposed between the two ends and the splice tray is closed. The splice tray is placed in a compression molding press which applies a predetermined time-temperature-pressure treatment profile which cures the adhesive film. The resulting splice has essentially the same physical dimensions of the strength tape, and similar stiffness characteristics to that of the strength tape. Further, the strength of the splice is more than sufficient for use in a communication cable. Because the complete splice process can be completed in less than 4 to 5 minutes, the splice can be performed on-line with the use of a strength tape accumulator.
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: April 17, 2001
    Assignee: Lucent Technologies, Inc.
    Inventors: Raymond P. DeFabritis, Richard D. Small, Jr., Carlos F. Solis, Priya L. Tabaddor
  • Patent number: 6035088
    Abstract: A method for performing fiber break-out in an optical fiber ribbon, which does not require shutting down the fibers in the ribbon while break-out is being performed, includes the step of placing the ribbon on a smooth surface that is either flat or curved with a radius much greater than the critical bend radius after the matrix material of the ribbon has been softened and swollen. The ribbon is temporarily affixed to the surface, and the softened matrix is then pulled away therefrom. The ribbon is then turned over and temporarily affixed to the surface and the remaining matrix is removed. The fibers that remain are then cleaned with an alcohol solution. In a variation of the method, the matrix is removed by rubbing or abrading it with a textured cloth or pad.
    Type: Grant
    Filed: September 18, 1998
    Date of Patent: March 7, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Vidyananda Bangalore Chandraiah, Kenneth Wade Jackson, Richard D. Small, Neil Wilbur Sollenberger
  • Patent number: 4795693
    Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.
    Type: Grant
    Filed: November 21, 1986
    Date of Patent: January 3, 1989
    Assignee: American Telephone and Telegraph Company, AT&T Technologies, Inc.
    Inventors: Jose A. Ors, Richard D. Small, Jr.
  • Patent number: 4628022
    Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.
    Type: Grant
    Filed: March 4, 1985
    Date of Patent: December 9, 1986
    Assignee: AT&T Technologies, Inc.
    Inventors: Jose A. Ors, Richard D. Small, Jr.
  • Patent number: 4601972
    Abstract: A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a photodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.
    Type: Grant
    Filed: July 26, 1985
    Date of Patent: July 22, 1986
    Assignee: AT&T Technologies, Inc.
    Inventor: Richard D. Small, Jr.
  • Patent number: 4554229
    Abstract: A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a photodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.
    Type: Grant
    Filed: April 6, 1984
    Date of Patent: November 19, 1985
    Assignee: AT&T Technologies, Inc.
    Inventor: Richard D. Small, Jr.
  • Patent number: 4511757
    Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.
    Type: Grant
    Filed: July 13, 1983
    Date of Patent: April 16, 1985
    Assignee: AT&T Technologies, Inc.
    Inventors: Jose A. Ors, Richard D. Small, Jr.