Abstract: Disclosed is a composite pallet for a reactive ion etching system consisting of an upper surface made of an insulative material, such as, silicon having therein a plurality of recessed pockets for holding the wafers to be etched and a bottom surface made of conductive material, such as, aluminum for electrically and thermally communicating the wafers with the cathode. The pallet diameter is larger than that of the cathode, but due to the conductive bottom surface the cathode is effectively extended over the entire pallet diameter. Such an arrangement provides excellent etch uniformity over all portions of the pallet.