Abstract: A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.

Abstract: A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.

Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Abstract: A control system for diagnosing a fuel system of a vehicle is provided. The system generally includes a correction term module that estimates a fuel correction term based on a first fuel correction value and a second fuel correction value, wherein the first fuel correction value is based on a first period and the second fuel correction value is based on a second period, and wherein the first period is longer than the second period. A diagnostic module diagnoses the fuel system of the vehicle based on the fuel correction term.

Abstract: A level sensing assembly senses the level of a fluid in a tank. The tank includes a fluid port that is disposed below the level of the fluid and an air port disposed above the level of fluid. The level sensing assembly includes a lower port in fluid communication with the fluid port of the tank. An upper port is in fluid communication with the lower port of the tank. A measuring vessel is disposed between the lower and upper ports and is in fluid communication therebetween. The measuring vessel includes an auxiliary port disposed adjacent the upper port. The level sensing assembly also includes a level sensor extending down through the auxiliary port into the measuring vessel to measure the level of the fluid in the measuring vessel and the level of the fluid in the tank.

Abstract: A level sensing assembly senses the level of a fluid in a tank. The tank includes a fluid port that is disposed below the level of the fluid and an air port disposed above the level of fluid. The level sensing assembly includes a lower port in fluid communication with the fluid port of the tank. An upper port is in fluid communication with the lower port of the tank. A measuring vessel is disposed between the lower and upper ports and is in fluid communication therebetween. The measuring vessel includes an auxiliary port disposed adjacent the upper port. The level sensing assembly also includes a level sensor extending down through the auxiliary port into the measuring vessel to measure the level of the fluid in the measuring vessel and the level of the fluid in the tank.

Abstract: Disclosed is a micro-fluid ejection head of an inkjet print cartridge. More specifically, disclosed is a thermally curable encapsulant composition for use in the micro-fluid ejection head of the inkjet print cartridge. The encapsulant composition includes from about 1.5 to about 95 percent by weight of one or more cross-linkable epoxy resins having a rigid backbone. Further, the encapsulant composition includes about 0.1 to about 35 percent by weight of one or more thermal curative agents. Further disclosed is a method for protecting the micro-fluid ejection head using the encapsulant composition.

Abstract: A level sensing assembly senses the level of a fluid in a tank. The tank includes a fluid port that is disposed below the level of the fluid and an air port disposed above the level of fluid. The level sensing assembly includes a lower port in fluid communication with the fluid port of the tank. An upper port is in fluid communication with the lower port of the tank. A measuring vessel is disposed between the lower and upper ports and is in fluid communication therebetween. The measuring vessel includes an auxiliary port disposed adjacent the upper port. The level sensing assembly also includes a level sensor extending down through the auxiliary port into the measuring vessel to measure the level of the fluid in the measuring vessel and the level of the fluid in the tank.

Abstract: A control system for diagnosing a fuel system of a vehicle is provided. The system generally includes a correction term module that estimates a fuel correction term based on a first fuel correction value and a second fuel correction value, wherein the first fuel correction value is based on a first period and the second fuel correction value is based on a second period, and wherein the first period is longer than the second period. A diagnostic module diagnoses the fuel system of the vehicle based on the fuel correction term.