Patents by Inventor Richard Dain

Richard Dain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soundboard apparatus and method of forming
    Patent number: 10204601
    Abstract: The present invention concerns soundboard apparatus for a musical instrument, the apparatus comprising a soundboard substrate formed of composite fibrous resin bonded material having a thickness of between 0.75 mm and 3 mm; and an outer layer formed of ultra-violet light blocking material having a thickness of between 0.5 and 0.9 mm. Further, the present invention relates to a method of forming a soundboard apparatus, the method comprising the steps of: bonding multiple layers of woven or straight stranded fibrous material in a resinous matrix to form a soundboard substrate, wherein the soundboard substrate is formed such that it is oversized with respect to final soundboard substrate dimensions; and finishing the soundboard substrate to form the final substrate, the finishing process being constrained to ensure that the final substrate dimensions are not compromised.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: February 12, 2019
    Assignee: Hurstwood Farm Piano Studios Ltd.
    Inventor: Richard Dain
  • SOUNDBOARD APPARATUS AND METHOD OF FORMING
    Publication number: 20170301320
    Abstract: The present invention concerns soundboard apparatus for a musical instrument, the apparatus comprising a soundboard substrate formed of composite fibrous resin bonded material having a thickness of between 0.75 mm and 3 mm; and an outer layer formed of ultra-violet light blocking material having a thickness of between 0.5 and 0.9 mm. Further, the present invention relates to a method of forming a soundboard apparatus, the method comprising the steps of: bonding multiple layers of woven or straight stranded fibrous material in a resinous matrix to form a soundboard substrate, wherein the soundboard substrate is formed such that it is oversized with respect to final soundboard substrate dimensions; and finishing the soundboard substrate to form the final substrate, the finishing process being constrained to ensure that the final substrate dimensions are not compromised.
    Type: Application
    Filed: March 27, 2015
    Publication date: October 19, 2017
    Inventor: Richard Dain