Patents by Inventor Richard Dalton Peters
Richard Dalton Peters has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11460778Abstract: Improved stripper solutions for removing photoresists from substrates are provided that exhibit improved compatibility with copper, leadfree solder, and epoxy-based molding compounds. The stripper solutions comprise a primary solvent, a secondary glycol ether solvent, potassium hydroxide, and an amine. The solutions also exhibit reduced potassium carbonate crystal formation compared to conventional formulations containing potassium hydroxide, and extended bath life compared to formulations containing tetramethylammonium hydroxide.Type: GrantFiled: March 26, 2019Date of Patent: October 4, 2022Assignee: VERSUM MATERIALS US, LLCInventors: Richard Dalton Peters, Yuanmei Cao
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Patent number: 11353794Abstract: Improved stripper solutions for removing photoresists from substrates are provided that typically have freezing points below about 0° C. and high loading capacities. The stripper solutions comprise dimethyl sulfoxide, quaternary ammonium hydroxide, and an alkanolamine having at least two carbon atoms, at least one amino substituent and at least one hydroxyl substituent, the amino and hydroxyl substituents attached to two different carbon atoms. Some formulations can additionally contain a secondary solvent. The formulations do not contain tetramethylammonium hydroxide. Methods for use of the stripping solutions are additionally provided.Type: GrantFiled: December 17, 2018Date of Patent: June 7, 2022Assignee: VERSUM MATERIALS US, LLCInventors: Richard Dalton Peters, Michael T. Phenis
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Publication number: 20190317409Abstract: Improved stripper solutions for removing photoresists from substrates are provided that exhibit improved compatibility with copper, leadfree solder, and epoxy-based molding compounds. The stripper solutions comprise a primary solvent, a secondary glycol ether solvent, potassium hydroxide, and an amine. The solutions also exhibit reduced potassium carbonate crystal formation compared to conventional formulations containing potassium hydroxide, and extended bath life compared to formulations containing tetramethylammonium hydroxide.Type: ApplicationFiled: March 26, 2019Publication date: October 17, 2019Applicant: Versum Materials US, LLCInventors: Richard Dalton Peters, Yuanmei Cao
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Publication number: 20190196337Abstract: Improved stripper solutions for removing photoresists from substrates are provided that typically have freezing points below about 0° C. and high loading capacities. The stripper solutions comprise dimethyl sulfoxide, quaternary ammonium hydroxide, and an alkanolamine having at least two carbon atoms, at least one amino substituent and at least one hydroxyl substituent, the amino and hydroxyl substituents attached to two different carbon atoms. Some formulations can additionally contain a secondary solvent. The formulations do not contain tetramethylammonium hydroxide. Methods for use of the stripping solutions are additionally provided.Type: ApplicationFiled: December 17, 2018Publication date: June 27, 2019Applicant: Versum Materials US, LLCInventors: Richard Dalton Peters, Michael T. Phenis
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Patent number: 10073352Abstract: The disclosure is directed solutions and processes to remove substances from substrates. In some cases, the substances can include photoresist on semiconductor wafers. The solution can include a quaternary ammonium hydroxide an amine, and optionally a corrosion inhibitor and/or a sugar alcohol. One or more sides of the substrate can be contacted with the solution to remove one or more substances from the substrate.Type: GrantFiled: April 12, 2016Date of Patent: September 11, 2018Assignee: VERSUM MATERIALS US, LLCInventors: Richard Dalton Peters, Travis W. Acra, Kimberly Dona Pollard
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Publication number: 20170293228Abstract: The disclosure is directed solutions and processes to remove substances from substrates. In some cases, the substances can include photoresist on semiconductor wafers. The solution can include a quaternary ammonium hydroxide an amine, and optionally a corrosion inhibitor and/or a sugar alcohol. One or more sides of the substrate can be contacted with the solution to remove one or more substances from the substrate.Type: ApplicationFiled: April 12, 2016Publication date: October 12, 2017Applicant: Dynaloy, LLCInventors: Richard Dalton Peters, Travis W. Acra, Kimberly Dona Pollard
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Patent number: 9650594Abstract: The disclosure is directed solutions and processes to remove substances from substrates. Optionally, the substances can include photoresist on semiconductor wafers. The solution may include a quaternary ammonium hydroxide, a first amine, a second amine, and a third amine with the total amount of amine being no greater than about 95% by weight of a total weight of the solution. Additionally, a solution may include at least one amine, a quaternary ammonium hydroxide, and water and be free of a polar solvent other than water with the solution having a dynamic viscosity that is no greater than about 60 centipoise.Type: GrantFiled: January 22, 2015Date of Patent: May 16, 2017Assignee: Dynaloy, LLCInventors: Travis Acra, Richard Dalton Peters, Kimberly Dona Pollard, Donald James Pfettscher
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Publication number: 20160215240Abstract: The disclosure is directed solutions and processes to remove substances from substrates. Optionally, the substances can include photoresist on semiconductor wafers. The solution may include a quaternary ammonium hydroxide, a first amine, a second amine, and a third amine with the total amount of amine being no greater than about 95% by weight of a total weight of the solution. Additionally, a solution may include at least one amine, a quaternary ammonium hydroxide, and water and be free of a polar solvent other than water with the solution having a dynamic viscosity that is no greater than about 60 centipoise.Type: ApplicationFiled: January 22, 2015Publication date: July 28, 2016Applicant: Dynaloy, LLCInventors: Travis Acra, Richard Dalton Peters, Kimberly Dona Pollard, Donald James Pfettscher
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Patent number: 9291910Abstract: The disclosure is directed solutions and processes to remove substances from substrates. In some cases, the substances can include photoresist on semiconductor wafers. The solution can include hydrogen peroxide in an amount that is no greater than 15% by weight of the total weight of the solution. The solution can also include a quaternary ammonium hydroxide and water. Further, the solution can include an amine, a co-solvent, or both. One or more sides of the substrate can be contacted with the solution to remove one or more substances from the solution.Type: GrantFiled: September 27, 2013Date of Patent: March 22, 2016Assignee: Dynaloy, LLCInventors: Richard Dalton Peters, Travis W. Acra, Yuanmei Cao, Nichelle Maria Gilbert, Michael Tod Phenis, Kimberly Dona Pollard, Joshua Cummins, Meng Guo, Donald James Pfettscher
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Patent number: 9158202Abstract: Compositions are described that are useful for removing organic and organometallic substances from substrates, for example, photoresist wafers. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic or organometallic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties, and specifically negative dry film photoresist from electronic devices.Type: GrantFiled: March 15, 2013Date of Patent: October 13, 2015Assignee: Dynaloy, LLCInventors: Richard Dalton Peters, Travis Acra, Yuanmei Cao, Spencer Erich Hochstetler, Michael Tod Phenis, Kimberly Dona Pollard
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Publication number: 20150270155Abstract: The present invention relates to an accommodating device for accommodation and mounting of a wafer for application of a fluid to a top of the wafer with the following features: a revolving ring section with: d) a revolving upper edge, e) a revolving recess and f) a circumferential wall running from the upper edge to the recess, a contact plane (A) arranged within the ring section for the accommodation of the wafer on a contact surface of the wafer, wherein the ring section by means of accommodation of the wafer forms with said wafer an accommodating space for accommodation of the fluid.Type: ApplicationFiled: November 21, 2012Publication date: September 24, 2015Applicant: EV GROUP INC.Inventors: Spencer Hochstetler, Richard Dalton Peters, Travis Acra
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Publication number: 20150219996Abstract: Stripping compositions are described that are useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays. The stripping compositions may be suitable for removing photoresists, including acrylic-based negative dry film photoresist, from electronic devices. In one embodiment, the stripping compositions can include a polar protic solvent, an amine or alkanoamine, and a quaternary ammonium hydroxide. In one embodiment the stripping compositions can include a polar protic solvent and at least two alkanoamines. The stripping compositions may be free of polar aprotic solvents.Type: ApplicationFiled: February 6, 2014Publication date: August 6, 2015Applicant: Dynaloy, LLCInventors: Richard Dalton Peters, Travis Acra, Yuanmei Cao, Nichelle Maria Gilbert, Michael Tod Phenis, Kimberly Dona Pollard, Joshua Cummins, Meng Guo, Donald James Pfettscher
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Patent number: 9062200Abstract: Polymer blends suitable for packaging are disclosed that include one or more impact modifiers; and one or more polyethylene terephthalate homopolymers or copolymers obtained by a melt phase polymerization using a catalyst system comprising aluminum atoms in an amount, for example, from about 3 ppm to about 60 ppm and one or more alkaline earth metal atoms, alkali metal atoms, or alkali compound residues in an amount, for example, from about 1 ppm to about 25 ppm, in each case based on the weight of the one or more polyethylene terephthalate homopolymers or copolymers The polymer blends disclosed exhibit improved low temperature toughness compared with blends made using polymers prepared with conventional catalyst systems.Type: GrantFiled: August 14, 2014Date of Patent: June 23, 2015Assignee: GRUPO PETROTEMEX, S.A. DE C.V.Inventors: Frederick Leslie Colhoun, Mark Edward Stewart, Stephen Weinhold, Richard Dalton Peters, Roger Lee Martin
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Patent number: 9029268Abstract: Processes are described to etch metals. In an embodiment, a process may include contacting a substrate with a stripping solution to remove photoresist from the substrate to produce a stripped substrate. The stripped substrate may include a plurality of solder pillars and a plurality of metal-containing field regions disposed around the plurality of solder pillars. In an illustrative embodiment, the plurality field regions may include copper. Additionally, the process may include rinsing the stripped substrate to produce a rinsed substrate. The rinsed substrate may be substantially free of a Sn layer or a Sn oxide layer. Further, the process may include contacting the rinsed substrate with an etch solution that is capable of removing an amount of one or more metals from the plurality of field regions.Type: GrantFiled: November 21, 2012Date of Patent: May 12, 2015Assignee: Dynaloy, LLCInventors: Richard Dalton Peters, Travis Acra, Spencer Erich Hochstetler, Kimberly Dona Pollard
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Publication number: 20150094249Abstract: The disclosure is directed solutions and processes to remove substances from substrates. In some cases, the substances can include photoresist on semiconductor wafers. The solution can include hydrogen peroxide in an amount that is no greater than 15% by weight of the total weight of the solution. The solution can also include a quaternary ammonium hydroxide and water. Further, the solution can include an amine, a co-solvent, or both. One or more sides of the substrate can be contacted with the solution to remove one or more substances from the solution.Type: ApplicationFiled: September 27, 2013Publication date: April 2, 2015Applicant: Dynaloy, LLCInventors: Richard Dalton Peters, Travis W. Acra, Yuanmei Cao, Nichelle Maria Gilbert, Michael Tod Phenis, Kimberly Dona Pollard, Joshua Cummins, Meng Guo, Donald James Pfettscher
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Patent number: 8916338Abstract: Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.Type: GrantFiled: November 19, 2013Date of Patent: December 23, 2014Assignee: Eastman Chemical CompanyInventors: Michael Wayne Quillen, Dale Edward O'Dell, Zachary Philip Lee, John Cleaon Moore, Edward Enns McEntire, Spencer Erich Hochstetler, Richard Dalton Peters, Rodney Scott Armentrout, Darryl W. Muck
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Publication number: 20140357797Abstract: Polymer blends suitable for packaging are disclosed that include one or more impact modifiers; and one or more polyethylene terephthalate homopolymers or copolymers obtained by a melt phase polymerization using a catalyst system comprising aluminum atoms in an amount, for example, from about 3 ppm to about 60 ppm and one or more alkaline earth metal atoms, alkali metal atoms, or alkali compound residues in an amount, for example, from about 1 ppm to about 25 ppm, in each case based on the weight of the one or more polyethylene terephthalate homopolymers or copolymers The polymer blends disclosed exhibit improved low temperature toughness compared with blends made using polymers prepared with conventional catalyst systems.Type: ApplicationFiled: August 14, 2014Publication date: December 4, 2014Inventors: Frederick Leslie CALHOUN, Mark Edward STEWART, Stephen WEINHOLD, Richard Dalton PETERS, Roger LEE MARTIN
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Patent number: 8859681Abstract: Polymer blends suitable for packaging are disclosed that include one or more impact modifiers; and one or more polyethylene terephthalate homopolymers or copolymers obtained by a melt phase polymerization using a catalyst system comprising aluminum atoms in an amount, for example, from about 3 ppm to about 60 ppm and one or more alkaline earth metal atoms, alkali metal atoms, or alkali compound residues in an amount, for example, from about 1 ppm to about 25 ppm, in each case based on the weight of the one or more polyethylene terephthalate homopolymers or copolymers The polymer blends disclosed exhibit improved low temperature toughness compared with blends made using polymers prepared with conventional catalyst systems.Type: GrantFiled: August 31, 2011Date of Patent: October 14, 2014Assignee: Grupo Petrotemex, S.A. de C.V.Inventors: Frederick Leslie Colhoun, Mark Edward Stewart, Stephen Weinhold, Richard Dalton Peters, Roger Lee Martin
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Publication number: 20140141622Abstract: Processes are described to etch metals. In an embodiment, a process may include contacting a substrate with a stripping solution to remove photoresist from the substrate to produce a stripped substrate. The stripped substrate may include a plurality of solder pillars and a plurality of metal-containing field regions disposed around the plurality of solder pillars. In an illustrative embodiment, the plurality field regions may include copper. Additionally, the process may include rinsing the stripped substrate to produce a rinsed substrate. The rinsed substrate may be substantially free of a Sn layer or a Sn oxide layer. Further, the process may include contacting the rinsed substrate with an etch solution that is capable of removing an amount of one or more metals from the plurality of field regions.Type: ApplicationFiled: November 21, 2012Publication date: May 22, 2014Applicant: DYNALOY, LLCInventors: Richard Dalton Peters, Travis Acra, Spencer Erich Hochstetler, Kimberly Dona Pollard
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Publication number: 20140137899Abstract: Processes are described to remove substances from substrates. In an embodiment, a process may include providing a substrate including a first side and a second side with a substance being disposed on at least a portion of the first side of the substrate. The process may also include contacting the substrate with a solution such that the first side of the substrate is coated with the solution, at least a portion of the second side is free of the solution and at least a portion of the substance is released from the first side of the substrate. Additionally, the process may include rinsing the substrate to remove at least a portion of the substance released from the first side of the substrate.Type: ApplicationFiled: March 15, 2013Publication date: May 22, 2014Applicant: DYNALOY, LLCInventors: Richard Dalton Peters, Travis Acra, Spencer Erich Hochstetler