Abstract: An article is disclosed that includes: a) a first polycarbonate substrate; b) a second polycarbonate substrate; and c) an adhesive composition disposed between the first polycarbonate substrate and the second polycarbonate substrate such that the first polycarbonate substrate is bonded to said second polycarbonate substrate through the adhesive composition; the adhesive composition includes an adhesive polymer that includes the reaction product of 1) an N-vinyl containing monomer selected from the group consisting of N-vinyl caprolactam, N-vinyl pyrrolidone, and N-vinylimidazole, and combinations thereof, and 2) an acrylic acid ester monomer of a non-tertiary alcohol having an alkyl group that includes 4 to 20 carbon atoms.

Abstract: An article is disclosed that includes:

Abstract: An article is disclosed that includes a) a first polycarbonate substrate; b) a second polycarbonate substrate; and c) an adhesive composition disposed between the first polycarbonate substrate and the second polycarbonate substrate such that the first polycarbonate substrate is bonded to said second polycarbonate substrate through the adhesive composition; the adhesive composition includes an adhesive polymer that includes the reaction product of 1) an N-vinyl containing monomer selected from the group consisting of N-vinyl caprolactam, N-vinyl pyrrolidone, and N-vinyl imidazole, and combinations thereof, and 2) an acrylic acid ester monomer of a non-tertiary alcohol having an alkyl group that includes 4 to 20 carbon atoms.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: An article is disclosed that includes:

Abstract: The present invention relates to a composition comprising a first monomer having the formula CH2═CHCOOR1, where R1 is a linear alkyl group having from 9 to 16 carbon atoms or a branched alkyl group having from 9 to 30 carbon atoms, and whose homopolymer has a Tg less than 0° C.; and/or a second monomer having the formula CH2═CHCOOR2, where R2 is an alkyl group having at least 9 carbon atoms whose homopolymer has a Tg greater than 15° C.; and a third component which may be another monomer, a polymer, surface-modified particles, or combinations thereof as well as article comprising the composition.

Abstract: A video mail delivery system for generating and transmitting video mail between a sender computer and a receiver computer over a communications network, such as the Internet. A video mail file containing audio and video content is recorded in a standard audio video interleave format and is then reformatted and compressed into an advanced streaming format. A video mail message window on the sender computer display enables the addition of an electronic text message to the video mail. A hyperlink to the compressed video mail file is inserted automatically into the video mail message window. When the video mail message is sent, the compressed video mail file is transmitted to a video store and forward server that stores the video mail file until it is accessed by the destination receiver computer.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: Methods and apparatus for applying a bonding layer to a member of an optical recording medium and for bonding together members of an optical recording medium. The methods and apparatus are useful for assembling optical recording media such as compact disks (CDs) and digital versatile disks (DVDs), and are particularly well suited for use with pressure sensitive adhesives.

Abstract: A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.

Abstract: A water dispersible polymeric composition comprises at least one sulfo group containing segment, which group comprises at least one urethane or urea connecting group, said composition also comprising at least one hydrophobic segment, which segment comprises at least one urethane or urea connecting group. The composition when dried can provide a coating on a substrate or an article having low surface energy and preferably ink receptive properties. The article can provide release capabilities towards adhesives, particularly pressure sensitive adhesives.

Abstract: A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

Abstract: A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

Abstract: The pressure-sensitive adhesive layer of the novel tape, like that of Silver U.S. Pat. No. 3,922,464, comprises a copolymer of alkyl acrylate such as isooctyl acrylate and a small amount of emulsifier monomer. The novel tape differs from that of Silver by incorporating tackifier resin, thus better resisting lifting forces at elevated temperatures while also being cleanly removable.

Abstract: A dry transfer article comprising a carrier film bearing a graphic design in the form of one or more layers of ink and an actinic radiation responsive adhesive overlapping the design, the ink serving as a mask to actinic radiation such that only adhesive in non-ink areas is exposed to radiation creating a differential adhesive tack which allows the article to be positioned on the substrate and the carrier film and exposed adhesive to be selectively removed leaving the graphic design and underlying unexposed adhesive bonded to the substrate.

Abstract: "Release on demand" pressure-sensitive adhesives and tapes which are readily detackifiable by exposure to actinic radiation. The adhesive system has an oxirane ring-bearing component blended thereinto (or preferably reacted therewith) to achieve an adhesive epoxy equivalent value of 400-900, preferably 450-700. The adhesive system also includes an effective amount of ionic photoinitiator capable of promoting the polymerization of oxirane rings.

Abstract: A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.