Abstract: Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.

Abstract: An optoelectronic assembly for providing bidirectional data transmission between fiber optic means (e.g., a pair of optical fibers) and an electrical circuit member (e.g., a printed circuit board). The assembly includes a two-part housing with first and second receptacle sections designed for accommodating a pair of optoelectronic devices. One of these devices serves as a receiver and the other a transmitter. These devices are aligned within the housing and electrically connected to a substrate member (e.g., ceramic) also positioned within the housing. The substrate provides the necessary electrical functioning and is in turn electrically connected (e.g., via conductor pins) to the described circuit member, this connection occurring through an opening within the bottom portion of the two-part housing. The assembly is designed for coupling with individual optical fiber members or, alternatively with a common duplex connector having optical fibers therein.