Abstract: A socket assembly is shown as generally including a cover assembly and a base frame assembly. A low insertion force (LIF) package assembly is connectable to the socket assembly and is comprised of a pin assembly, housing a package. The cover assembly includes a socket cover frame array and the base frame assembly includes a socket contact frame array. The cover assembly is spring loadable relative to the base frame assembly to provide a low insertion force application for the package.

Abstract: A fully buffered memory module is disclosed having a two piece housing comprised of a primary housing portion and an alignment plate. An array of terminals is included having at least two terminal configurations where the terminals are trapped between the primary housing portion and the alignment plate. A printed circuit board tine of the electrical terminals extend through the alignment plate while a contact portion protrudes into a slot which receives the memory module.

Abstract: A memory module electrical connector is comprised of an insulative housing and a plurality of electrical terminals. The terminals are stamped and formed from conductive material to include resilient contact portions for interconnection to the module, and compliant pin portions for interconnection to the printed circuit board. The compliant pin portions of the connector are laterally staggered, with some compliant pin portions being positioned adjacent to a slot in the housing for receiving the memory module, and alternate contacts are positioned distant from the slot, thereby staggering the compliant pin portions. The compliant pin sections include an upstanding, rigidifying section to rigidify the compliant pin portion during the insertion of the electrical connector and the plurality of compliant pin portions into the printed circuit board.