Abstract: The disclosed invention provides a circuit and burn-in test method for semiconductor devices that increases the speed of burn-in tests. The present invention accomplishes this by causing each of the devices under test to be tested multiple times (from 2 to 32+ times) during each power cycle. By such multiple cycling of the unit under test, during the power cycle, the total test time is shortened. It has also been found that the devices tested in accordance with the present invention are more efficiently stressed and have a reliability greater than devices passing the prior art tests. In accordance with the invention, the memory or logic devices under test are provided with a respective clock means that will operate each of the devices under test through multiple (from 2 to 32+ times) write and read operations during each power cycle. Data coherency for each read operation is provided as is the inversion of data if any fail is recorded during a read operation.