Patents by Inventor Richard E. Jaeger

Richard E. Jaeger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive compositions containing organic spacers and methods for use thereof
    Patent number: 6806309
    Abstract: In accordance with the present invention, there are provided adhesive compositions and methods for use thereof, comprising at least one maleimide-containing monomer, at least one cure initiator, and a plurality of spacer elements constructed from one or more organic polymers. Invention adhesive compositions are useful for controlling bond line thickness and planarity between a device and a substrate. Bond line thickness and planarity is largely determined by the size of the spacer elements in the adhesive composition.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: October 19, 2004
    Assignee: Henkel Corporation
    Inventor: Richard E. Jaeger
  • Adhesive compositions containing organic spacers and methods for use thereof
    Publication number: 20030230814
    Abstract: In accordance with the present invention, there are provided adhesive compositions and methods for use thereof, comprising at least one maleimide-containing monomer, at least one cure initiator, and a plurality of spacer elements constructed from one or more organic polymers. Invention adhesive compositions are useful for controlling bond line thickness and planarity between a device and a substrate. Bond line thickness and planarity is largely determined by the size of the spacer elements in the adhesive composition.
    Type: Application
    Filed: February 28, 2002
    Publication date: December 18, 2003
    Inventor: Richard E. Jaeger