Patents by Inventor Richard E. Seeger, Jr.

Richard E. Seeger, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4946733
    Abstract: New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.
    Type: Grant
    Filed: July 21, 1988
    Date of Patent: August 7, 1990
    Assignee: Amoco Corporation
    Inventors: Richard E. Seeger, Jr., Noredin H. Morgan, Joseph R. Landry, Jr.
  • Patent number: 4775439
    Abstract: A low temperature method of forming a circuit pattern on a plastic substrate which comprises applying a slurry of a vaporizable solvent, metal particles and a small quantity of binder in the shape of the circuit pattern desired to a removable layer, vaporizing the solvent, covering the powdered metal and binder with an adhesive to hold the powdered metal and carrier in place on the removable layer, laminating the hydrocarbon containing substrate with pressure and heat to cause compacting of said powder and bonding of said compacted powder to said substrate by adhesive layer, said heat being insufficient to destroy said adhesive, substrate and removable layer, and separation of the removable layer. A circuit pattern held on a removable layer by an adhesive overlying same is also disclosed.
    Type: Grant
    Filed: July 25, 1983
    Date of Patent: October 4, 1988
    Assignee: Amoco Corporation
    Inventors: Richard E. Seeger, Jr., Noredin H. Morgan
  • Patent number: 4759970
    Abstract: New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.
    Type: Grant
    Filed: April 27, 1987
    Date of Patent: July 26, 1988
    Assignee: Amoco Corporation
    Inventors: Richard E. Seeger, Jr., Noredin H. Morgan, Joseph R. Landry, Jr.
  • Patent number: 4046975
    Abstract: Sealed keyboard sandwich having actuator means, a plurality of contactor means, a plurality of contact means and support means therefore, said contacts and contactors forming a plurality of key units, and gas passage means positioned between said actuator means and said support means for selectively permitting the flow of trapped gas from the key units upon depression of a portion thereof. In the preferred structure the sandwich is hermetically sealed from the outside atmosphere.
    Type: Grant
    Filed: September 22, 1975
    Date of Patent: September 6, 1977
    Assignee: Chomerics, Inc.
    Inventor: Richard E. Seeger, Jr.
  • Patent number: 3978297
    Abstract: A keyboard device which includes a frame having a plurality of bores in which there is positioned a core for slideable motion therein, and a keyboard top positioned over the bores and preferably sealing each of the cores within the bores of the frame so that no particles of food or dust can accumulate between the cores and the frame while still permitting the cores to be depressed to cause a contactor means to engage contact means. In the preferred embodiment the cores are loose within the bores and are held therein from the top by said keyboard top. In addition, a mask to simulate the appearance of a frame about the portions of the top is provided. In addition, the preferred embodiment is sealed on the top and bottom to protect the in words from the environment.
    Type: Grant
    Filed: March 31, 1975
    Date of Patent: August 31, 1976
    Assignee: Chomerics, Inc.
    Inventors: William J. Lynn, Richard E. Seeger, Jr.