Abstract: Methods and apparatuses to improve the temperature uniformity of a workpiece being processed on a heated platen of a thermal processing station. A heated platen is enclosed in a housing incorporating an additional heat source that uniformly outputs thermal energy into the process chamber in which the heated platen is positioned. In preferred embodiments, this heat source is positioned in the lid of the housing. It is additionally preferred that the heated lid includes features that provide a gas flow path to introduce to and/or purge gas from the process chamber. In terms of photoresist performance, the improved thermal uniformity provided by using such an additional heat source in the housing, e.g., in the lid, offers improved line width control and line uniformity across a wafer.

Abstract: Methods and apparatuses to improve the temperature uniformity of a workpiece being processed on a heated platen of a thermal processing station. A heated platen is enclosed in a housing incorporating an additional heat source that uniformly outputs thermal energy into the process chamber in which the heated platen is positioned. In preferred embodiments, this heat source is positioned in the lid of the housing. It is additionally preferred that the heated lid includes features that provide a gas flow path to introduce to and/or purge gas from the process chamber. In terms of photoresist performance, the improved thermal uniformity provided by using such an additional heat source in the housing, e.g., in the lid, offers improved line width control and line uniformity across a wafer.

Abstract: A method of forming EMI shielded enclosures, an EMI shielded enclosure and EMI shield are provided. A sealer composition is applied onto a surface and is allowed to substantially dry cure into a uniform, seamless layer. An adhesive composition is applied to the dried sealer composition. Then, an electrically-conductive material, such as metallic sheet, such as copper sheeting, is attached to the dried sealer composition by the adhesive composition. Alternatively, a bonded sheet of dielectric material is applied to the adhesive composition. Then the metallic sheet is attached to the bonded sheet of dielectric material by an adhesive composition second layer.

Abstract: A window for electromagnetic interference shielded enclosures has a shielding screen system with two grids having dimensionally different mesh patterns to overcome optical interference and distraction resulting from the moire effect. The screens are supported in spaced, angularly offset positions on a continuous frame providing electrical continuity between the shielding system and the shielding layer of a surrounding wall.

Abstract: A panel system for EMI (electromagnetic interference) shielded enclosures includes panels having a framework, a substrate attached to the framework and a shielding layer overlying the substrate at the face of the panel and extending around the panel edges. Edge frame members of the framework are capable of floating or flexing to assure intimate contact between the shielding layers of adjacent panels when the panels are attached together to make a shielded enclosure. Seams between adjacent panels are provided with grooves for positively defining regions of contact and shielding the fasteners used to join the adjacent panels.

Abstract: A window for an electromagnetic interference shielded enclosure includes a frame defining a window aperture. A pair of spaced apart, light transmitting, fluid impervious panels are supported by the frame and cover the aperture. In the region enclosed by the frame and the pair of panels, a quantity of light transmitting and electrically conductive fluid is captured. The fluid is electrically connected through the frame to the shield of an enclosure to provide an optically transparent window while maintaining the integrity of the shield.