Patents by Inventor Richard Earl Chamberlain

Richard Earl Chamberlain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor device having a lead bonded to a surface thereof
    Patent number: 3956820
    Abstract: An improved method of manufacturing a semi-conductor device having a lead bonded to a surface thereof, wherein the device is fabricated by removing a section of a substrate which surrounds a surface portion of the substrate comprising the surface to which the lead is bonded, includes bonding the lead to the surface portion of the substrate prior to removing the section.
    Type: Grant
    Filed: February 26, 1975
    Date of Patent: May 18, 1976
    Assignee: RCA Corporation
    Inventors: George Allan Swartz, Richard Earl Chamberlain