Patents by Inventor Richard Eddins

Richard Eddins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid-cooled assembly and method
    Patent number: 11950394
    Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 2, 2024
    Assignee: GE Aviation Systems LLC
    Inventors: Brian Magann Rush, Christopher James Kapusta, David Richard Esler, Liang Yin, Richard Anthony Eddins, Judd Everett Swanson, Liqiang Yang
  • Circular heatsink
    Patent number: 10794637
    Abstract: A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: October 6, 2020
    Assignee: GE Aviation Systems LLC
    Inventors: Judd Everett Swanson, Richard Eddins, Michel Engelhardt, Christopher Mouris Astefanous
  • CIRCULAR HEATSINK
    Publication number: 20180094876
    Abstract: A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.
    Type: Application
    Filed: October 3, 2016
    Publication date: April 5, 2018
    Inventors: Judd Everett Swanson, Richard Eddins, Michel Engelhardt, Christopher Mouris Astefanous