Abstract: A matrix array ultrasound probe passively dissipates heat developed by the matrix array transducer and beamformer ASIC away from the distal end of the probe. The heat developed in the transducer stack is coupled to a metallic frame inside the handle of probe. A metallic heatspreader is thermally coupled to the probe frame to convey heat away from the frame. The heatspreader surrounds the inside of the probe handle and has an outer surface which is thermally coupled to the inner surface of the probe housing. Heat is thereby coupled evenly from the heatspreader into the housing without the development of hotspots in the housing which could be uncomfortable to the hand of the sonographer.

Abstract: A backing block for an ultrasonic transducer array stack of an ultrasound probe is formed as a composite structure of graphite foam impregnated with an epoxy resin. The epoxy resin penetrates the porous foam structure at least part-way into the depth of the graphite foam block and, when cured, provides the backing block with good structural stability. The composite graphite foam backing block is bonded to the integrated circuit of a transducer to provide high thermal conductivity away from the transducer and good acoustic attenuation or scattering of rearward acoustic reverberations.

Abstract: A backing block for an ultrasonic transducer array stack of an ultrasound probe is formed as a composite structure of material of high thermal conductivity in which is embedded a structure of acoustic dampening material. In a constructed embodiment the composite structure is formed from a block of thermally conductive graphite in which a plurality of cylindrical holes are formed which are filled with acoustic dampening material. The holes are angled in relation to the Z-axis direction from the rear of the transducer stack so that reverberation energy traveling in that direction will encounter acoustic dampening material. The graphite around the holes is effective to conduct heat to the rear of the probe and away from the transducer stack and its ASIC.

Abstract: The present invention is directed to a scanhead having an integral beamformer and a transducer assembly that is demountable from the scanhead. The scanhead has a frontal portion including a transducer assembly, and a rear portion including a beamformer. The frontal portion further includes a connective interface to electrically communicate with a corresponding connective interface on the rear portion. In a first embodiment, the frontal portion includes an interior portion with an opening to slidably receive a corresponding portion of the rear portion. In another embodiment, an interposer is positioned between the frontal portion and the rear portion to electrically couple the spaced apart connective interfaces. In still another embodiment, the frontal and rear portions are axisymmetrically-shaped and have corresponding threaded portions to couple the frontal and rear portions.

Abstract: The present invention is directed to a scanhead having an integral beamformer and a transducer assembly that is demountable from the scanhead. The scanhead has a frontal portion including a transducer assembly, and a rear portion including a beamformer. The frontal portion further includes a connective interface to electrically communicate with a corresponding connective interface on the rear portion. In a first embodiment, the frontal portion includes an interior portion with an opening to slidably receive a corresponding portion of the rear portion. In another embodiment, an interposer is positioned between the frontal portion and the rear portion to electrically couple the spaced apart connective interfaces. In still another embodiment, the frontal and rear portions are axisymmetrically-shaped and have corresponding threaded portions to couple the frontal and rear portions.